Interposer Semiconductor Package With Stress-Relief Encapsulant Groove
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating multiple dies and interposer structures while ensuring reliable electrical connections and mechanical stability, which affects the reliability and cost-effectiveness of semiconductor devices.
Innovation Solution
The method involves forming an interposer structure with conductive pillars and metallic patterns on a substrate, connecting dies to the interposer through conductive bumps, and encapsulating the assembly with an insulating material that includes a groove to reduce mechanical stress and eliminate the need for underfills, thereby enhancing electrical connectivity and reducing material usage and processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple dies and interposer structures are integrated using conventional packaging technologies, then electrical connections and mechanical stability can be achieved, but the integration efficiency is reduced and reliability is compromised
Solution Approach 1:
The patent merges the underfill material function into the encapsulant by forming the encapsulant to directly fill spaces between dies and the interposer structure, eliminating the need for separate underfill application steps and improving integration efficiency while maintaining mechanical stability and electrical connections
2Ease of manufacture
If conventional packaging methods are used with separate underfills, then mechanical stability can be maintained, but material usage increases and processing steps are extended
Solution Approach 1:
The encapsulant is designed to perform multiple functions simultaneously: it encapsulates the interposer structure and dies while also filling the spaces between them, thereby merging the previously separate underfill function into a single material application step that reduces both material usage and processing complexity
Solution Approach 2:
The encapsulant is formulated and positioned to serve multiple purposes: structural support, electrical insulation, mechanical stabilization, and space filling between components, replacing the need for specialized underfill materials and application processes
3Reliability
If conventional encapsulation without integrated stress reduction features is used, then manufacturing is simpler, but mechanical stress increases affecting reliability
Solution Approach 1:
The encapsulant is configured with varying properties in different regions: it fills spaces between dies and interposer with specific viscosity and curing characteristics to reduce mechanical stress locally, while maintaining overall structural integrity, thereby improving mechanical stability without requiring complex multi-component systems
Data Source
AI summary
A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.