Interposer Package Layout for Uniform Encapsulation Flow
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Solution Overview
Problem
In semiconductor device packaging, the uneven flow of encapsulating material during the molding process can lead to incomplete coverage of interposers and components, resulting in inconsistent package density and reliability issues due to variations in flow rates across different regions of the carrier surface.
Innovation Solution
The use of a carrier with interposers arranged in an irregular pattern and conductive vias with a sandglass-shaped cross-section, along with multiple encapsulants to ensure uniform encapsulation and separation of interposers, addresses the uneven flow issue by facilitating smooth and consistent encapsulation across the carrier surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If interposers are arranged in a regular pattern on the carrier, then manufacturing process is simple, but encapsulating material flows unevenly causing incomplete coverage and inconsistent package density
Solution Approach 1:
The patent applies asymmetry by arranging interposers in an irregular pattern rather than a regular grid. This irregular arrangement creates more uniform flow paths for the encapsulating material across the carrier surface, preventing pooling and ensuring consistent coverage. The asymmetric positioning of interposers balances the flow dynamics of the encapsulant during molding.
2Reliability
If encapsulating material is applied to cover all interposers, then complete coverage is achieved, but flow rate variations cause inconsistent package density across regions
Solution Approach 1:
The patent applies local quality by creating region-specific flow characteristics through the irregular interposer arrangement. Different areas of the carrier have differently positioned interposers that locally adjust the encapsulant flow, ensuring each region receives appropriate material distribution. This localized optimization prevents both pooling and insufficient coverage in different package regions.
3Manufacturing precision
If conventional molding process is used with regular interposer arrangement, then manufacturing is straightforward, but encapsulation is incomplete and package density varies
Solution Approach 1:
The patent applies preliminary action by pre-arranging interposers in an optimized irregular pattern before the molding process. This pre-positioning ensures that when the encapsulating material is applied, it naturally flows uniformly across all interposers without requiring complex molding adjustments. The preliminary arrangement eliminates the need for complex real-time process control during molding.
Data Source
AI summary
A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.