Interposer-Based 3D Electronic Device Package Footprint Reduction
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Solution Overview
Problem
There is a need to reduce the size of the mounting area for electronic components in electronic device packages to accommodate the increasing integration of components in smaller and more compact devices.
Innovation Solution
The electronic device package incorporates a package substrate, interposers, a processing device, high bandwidth memory devices, a power management integrated circuit, and passive devices, where the interposers act as a medium to mount these components on the substrate, minimizing the footprint and providing stable power to the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electronic components are mounted on a board substrate using conventional methods, then the components can be electrically connected and functionally integrated, but the mounting area footprint becomes too large for compact device requirements
Solution Approach 1:
The patent transitions from planar mounting on a board substrate to three-dimensional stacking using interposers. Multiple components (processing device, memory device, passive device) are arranged in vertical layers above the interposer, utilizing the Z-dimension to reduce the horizontal footprint while maintaining electrical connectivity through vertical vias and conductors.
Solution Approach 2:
The interposer serves as an intermediary substrate between the package substrate and the mounted components. It provides a platform for component placement and includes through-vias and conductors that establish electrical connections between components and the package substrate, enabling compact three-dimensional integration without direct board substrate mounting.
2Area of stationary object
If components are integrated more densely to reduce device size, then the mounting area decreases, but power delivery stability to components becomes more challenging
Solution Approach 1:
Power delivery networks are extended into the vertical dimension through the interposer structure. Multiple power and ground layers are stacked within the interposer, providing low-inductance power paths from the package substrate through the interposer to the mounted components, ensuring stable power delivery in compact configurations.
Solution Approach 2:
The power delivery system is segmented into multiple independent power and ground layers within the interposer. This segmentation allows for optimized power distribution to different components (processing device, memory device, passive device) with dedicated power paths, reducing noise and improving power supply stability.
Data Source
AI summary
An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.