Interposer Semiconductor Package With Zoned Passivation for Low Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packages face challenges in maintaining electrical connections and preventing warpage between stacked packages, particularly due to variations in passivation layer thickness and distribution, which affects the reliability and efficiency of interposer connections.
Innovation Solution
The semiconductor package design incorporates a structured arrangement of passivation layers and connection terminals with varying thicknesses and pitches, along with an interposer, to enhance electrical connectivity and reduce warpage by optimizing the thickness and placement of passivation layers and connection pillars, allowing for improved contact between the substrate and interposer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform passivation layer structure is used in semiconductor packages, then the manufacturing process is simple, but electrical connection reliability deteriorates due to variations in connection quality
Solution Approach 1:
The patent applies local quality by implementing a multi-layer passivation structure where different regions have different numbers of passivation layers. Specifically, the first passivation layer is disposed in a first region and a second region, while a second passivation layer is disposed only in the second region, creating localized structural variations that optimize electrical connection reliability in different areas of the substrate.
Solution Approach 2:
The patent segments the passivation structure into multiple distinct layers (first passivation layer and second passivation layer) with different spatial distributions. The first passivation layer covers both first and second regions, while the second passivation layer is confined to the second region, creating a segmented architecture that allows independent optimization of connection properties in different zones.
2Reliability
If connection terminals are densely arranged to improve electrical connectivity, then connection reliability improves, but warpage between stacked packages increases
Solution Approach 1:
The patent applies local quality by strategically positioning connection terminals in specific regions rather than uniform distribution. Connection terminals are disposed in the second region where the second passivation layer provides enhanced insulation and structural support, allowing dense terminal arrangement in areas where it benefits connectivity while maintaining overall package stability.
Solution Approach 2:
The interposer serves as an intermediary component between stacked packages, providing a platform for connection terminals while its material composition and structural design help compensate for warpage. The interposer's mechanical properties act as a mediator to maintain alignment and electrical connection reliability despite differential warpage in the stacked package structure.
3Reliability
If passivation layer thickness is increased to improve insulation and connection stability, then electrical connection reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies local quality by varying the thickness and presence of passivation layers in different regions. The second passivation layer is disposed only in the second region where enhanced insulation is needed for connection terminal stability, while the first passivation layer provides baseline protection across both regions. This localized thickening achieves reliability improvements without uniformly increasing manufacturing complexity across the entire substrate.
Data Source
AI summary
A semiconductor package including: a first substrate including a first surface including a first region and a second region at least partially surrounding the first region, wherein the first substrate includes a first insulating layer, a first conductive pattern in the first insulating layer, a first passivation layer disposed in the first region and the second region, and a second passivation layer disposed on the first passivation layer in the second region; an interposer overlapping the first substrate and including a second insulating layer and a second conductive pattern in the second insulating layer; a first connection terminal disposed on the first passivation layer in the first region; and a second connection terminal disposed on the second passivation layer in the second region, wherein the first conductive pattern and the second conductive pattern are connected to each other through the first connection terminal and the second connection terminal.