Interposer Package-on-Package Structure for Thin IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated circuit packaging technologies face challenges such as increased thickness, higher costs, and sensitivity to manufacturing variations due to the use of mold compounds and copper core solder balls, as well as warpage issues with interposer substrates, which hinder efficient integration of components and thermal performance.
Innovation Solution
The interposer enabled package-on-package (PoP) structure with a bare die flip chip design, utilizing a thin adhesive material to minimize bond-line thickness, eliminate the need for mold compounds, and reduce the complexity of solder connections, thereby enhancing thermal and electrical performance while providing EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional packaging with mold compounds and copper core solder balls is used, then structural support and electrical connection are provided, but package thickness increases and manufacturing cost increases
Solution Approach 1:
The patent removes the mold compound layer entirely from the packaging structure. Instead of using traditional mold compounds to encapsulate and protect the die, the invention uses a substrate with integrated support structures and adhesive bonding to achieve the same protective and structural functions, thereby reducing package thickness and simplifying manufacturing.
Solution Approach 2:
The patent introduces an adhesive layer as an intermediary between the die and substrate, replacing the traditional copper core solder ball interconnection method. This adhesive intermediary provides both mechanical bonding and electrical connection functions, eliminating the need for complex solder ball assembly processes and reducing overall package height.
2Adaptability or versatility
If interposer substrate is used for integration, then component integration is improved, but warpage issues occur due to manufacturing variations
Solution Approach 1:
The patent makes the substrate multi-functional by integrating both the support structure and the interconnection function into a single substrate layer. The substrate serves as the mechanical foundation, the adhesive bonding layer, and the electrical interconnection medium, eliminating the need for separate interposer substrates and reducing warpage issues associated with multiple layered structures.
Solution Approach 2:
The patent changes the material parameters and structural configuration of the substrate to improve dimensional stability. By using specific substrate materials with appropriate thermal and mechanical properties, and by optimizing the substrate thickness and support structure geometry, the invention minimizes warpage while maintaining component integration capabilities.
3Length of moving object
If thin adhesive material is used to minimize bond-line thickness, then package thickness is reduced, but bonding strength must be maintained
Solution Approach 1:
The patent optimizes the adhesive material parameters by selecting adhesives with high bond strength per unit thickness. The invention specifies adhesive materials with appropriate shear strength, tensile strength, and thickness characteristics that enable thin bond lines while maintaining or exceeding the bonding strength requirements of traditional thicker adhesive designs.
Solution Approach 2:
The patent uses composite material structures by combining the thin adhesive layer with reinforced substrate structures and optimized die attachment geometries. This composite approach allows the thin adhesive to achieve sufficient bonding strength through the synergistic effect of the adhesive material properties and the overall structural design.
4Length of moving object
If mold compounds are eliminated, then package thickness and cost are reduced, but structural support and protection functions must be maintained
Solution Approach 1:
The substrate is designed to perform multiple functions previously handled by separate components: it provides mechanical support for the die, serves as the bonding surface through integrated adhesive layers, enables electrical interconnection through conductive pathways, and offers environmental protection. This multi-functional substrate eliminates the need for mold compounds while maintaining all necessary structural and protective functions.
Solution Approach 2:
The patent segments the protective and support functions into distinct layers within the substrate structure, with each layer optimized for its specific function. The substrate includes support structures, adhesive bonding layers, and protective coatings that work together to replace the encapsulating function of mold compounds, providing structural support and protection without the added thickness.
Data Source
AI summary
An integrated circuit (IC) package includes an IC die having a first surface and a second surface opposite of the first surface. The IC package includes first contact members coupled to the second surface of the IC die. The IC package includes a bottom substrate having a first surface and a second surface opposite of the first surface, where the first surface of the bottom substrate is coupled to the second surface of the IC die via the first contact members. The IC package includes an interposer substrate coupled to the first surface of the IC die via an adhesive material, where the adhesive material is disposed on at least a surface of the interposer substrate. The IC package includes second contact members coupled along a periphery of the interposer substrate, where the interposer substrate is coupled to the first surface of the bottom substrate via the second contact members.