Interposer Package Assembly With Tilted Mirrors for Optical Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated circuit packages are inadequate in achieving high integration density and efficient optical coupling, leading to suboptimal performance and size constraints.
Innovation Solution
Fabrication of mirrors on thinned glass substrates and integration with photonic and electronic dies through an interposer structure for improved optical and electrical coupling, utilizing a fusion bonding process and optical components like waveguides and lenses to enhance communication performance and reduce package assembly cycle time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional integrated circuit packages are used, then manufacturing simplicity is maintained, but optical coupling efficiency is insufficient
Solution Approach 1:
The package assembly is segmented into distinct functional modules: photonic dies for optical signal generation/detection, electronic dies for electrical signal processing, and an interposer structure for optical coupling. This segmentation allows each component to be optimized independently while achieving high overall optical coupling efficiency through specialized interfaces.
Solution Approach 2:
An interposer structure serves as an intermediary between photonic dies and electronic dies, providing specialized optical coupling interfaces and waveguide structures that bridge the optical and electrical domains. This intermediary enables efficient optical signal transmission while maintaining electrical signal integrity.
2Area of moving object
If integration density is increased, then more components fit in given area, but optical coupling efficiency deteriorates
Solution Approach 1:
The package assembly transitions from planar integration to three-dimensional stacking, with photonic dies, electronic dies, and interposer structures arranged in multiple layers. This vertical dimensionality allows high integration density while maintaining optimal optical coupling paths through the interposer structure's waveguide interfaces.
Solution Approach 2:
The interposer structure implements local quality optimization by providing specialized optical coupling regions with precise waveguide structures and reflective surfaces at specific locations, while other regions maintain electrical connectivity functions. This localized optimization enables high optical coupling efficiency without compromising overall integration density.
3Productivity
If package assembly cycle time is reduced, then productivity increases, but manufacturing precision may be compromised
Solution Approach 1:
Optical coupling structures, including waveguides and reflective surfaces, are pre-formed on the interposer structure before final die assembly. This preliminary action ensures precise optical alignment is established in advance, allowing rapid subsequent assembly without compromising optical coupling efficiency.
Solution Approach 2:
Multiple functions are merged into the interposer structure: optical coupling interfaces, electrical interconnects, and mechanical support functions are integrated into a single component. This merging reduces the number of assembly steps and interfaces, thereby reducing cycle time while maintaining manufacturing precision through a reduced number of alignment-critical interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher communication performance and more compact packaging by enhancing optical coupling efficiency and reducing cycle time in package assembly.
Implementation Method 1
a light beam from an optical fiber over the first die is reflected by the third tilted metal layer, the first tilted metal layer, the second tilted metal layer, and the fourth tilted metal layer sequentially
Implementation Method 2
utilizing a fusion bonding process
Data Source
AI summary
A method of forming a package assembly includes the following operations. An interposer structure, a first die and a second die are provided. The interposer structure includes a first tilted metal layer and a second tilted metal layer facing each other. The first die includes a first substrate and a third tilted metal layer embedded in a first insulating layer on the first substrate. The second die includes a second substrate and a fourth tilted metal layer embedded in a second insulating layer on the second substrate. The first die and the second die are bonded to the interposer structure with the first substrate and the second substrate facing up, so that a light beam from an optical fiber over the first die is reflected by the third tilted metal layer, the first tilted metal layer, the second tilted metal layer, and the fourth tilted metal layer sequentially.