Interposer Package Structure for High-Density Wirebonding
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Solution Overview
Problem
High-density interconnect (HDI) substrates and multi-layered redistribution layers (RDL) used in small form factor electronic devices increase cost and Z-height, and lack mechanical strength to withstand wirebond interconnect coupling with integrated circuits like ASIC, DRAM, and NAND.
Innovation Solution
An electronic device package with a redistribution layer and interposers that electrically couple electronic components, providing reduced Z-height and lower cost, with interconnect interfaces on the top side having higher density than on the bottom side, facilitating wirebond connections and mechanical strength through epoxy-based laminate structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If HDI substrates and multi-layered RDL are used to achieve high component density, then component density is improved, but Z-height increases and mechanical strength decreases
Solution Approach 1:
The interposer is divided into multiple layers (first interposer layer, second interposer layer) with different functions. The first layer provides mechanical support and lower-density interconnect interfaces, while the second layer provides higher-density interconnect interfaces for wirebond connections, allowing each layer to be optimized independently
Solution Approach 2:
The interposer uses composite material structure combining epoxy-based laminate materials with copper interconnect layers. This composite structure provides both the mechanical strength needed to withstand wirebonding and the electrical connectivity for high-density interconnections
2Quantity of substance
If HDI substrates and multi-layered RDL are used to achieve high component density, then component density is improved, but manufacturing cost increases
Solution Approach 1:
The interposer uses cost-effective epoxy-based laminate materials and standard wirebonding processes instead of expensive HDI substrate technologies, achieving high-density interconnection at lower manufacturing cost
Solution Approach 2:
The interconnect interface density is varied across different layers and locations of the interposer, with higher density on the top side for wirebonding and lower density on the bottom side, optimizing both performance and manufacturing cost
3Reliability
If wirebond interconnect coupling is used with integrated circuits, then electrical connection is achieved, but mechanical strength is insufficient to withstand the wirebonding process
Solution Approach 1:
The interposer combines epoxy-based laminate material with copper interconnect layers to create a composite structure that provides both the mechanical strength needed to withstand wirebonding forces and the electrical conductivity for reliable signal transmission
Solution Approach 2:
The interposer is pre-formed with reinforced structures and appropriate interconnect interface densities before the wirebonding process, providing the necessary mechanical support to withstand the wirebonding forces during assembly
Data Source
AI summary
Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include an electronic component, a redistribution layer, and an interposer electrically coupling the redistribution layer and the electronic component. The interposer can have interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer. A density of the interconnect interfaces on the top side can be greater than a density of the interconnect interfaces on the bottom side. Associated systems and methods are also disclosed.