Multi-Piece Interposer Packaging for Semiconductor Warpage Control
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Solution Overview
Problem
Semiconductor packages face warpage issues due to differing thermal expansion coefficients of materials, leading to stress concentration and reduced productivity and reliability.
Innovation Solution
A semiconductor package design featuring an interposer with multiple pieces and a molding member with a higher thermal expansion coefficient than the interposer, which alleviates warpage by alternating components with different expansion coefficients on the same plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If materials with different thermal expansion coefficients are used in the semiconductor package, then the package can accommodate thermal stress, but warpage occurs due to differential expansion
Solution Approach 1:
The patent applies thermal expansion principle by selecting a molding member with a thermal expansion coefficient higher than that of the interposer. This deliberate mismatch in thermal expansion coefficients allows the molding member to compensate for the differential expansion between the interposer and other package components, thereby reducing warpage while accommodating thermal stress.
Solution Approach 2:
The patent uses composite materials by combining the interposer (with lower thermal expansion coefficient) and the molding member (with higher thermal expansion coefficient) in a layered structure. This composite construction allows the different materials to work together, with the molding member's higher expansion coefficient compensating for stress concentration and reducing overall package warpage.
2Productivity
If an interposer is used to arrange semiconductor chips efficiently, then integration density increases, but stress concentration occurs due to material mismatches
Solution Approach 1:
The molding member acts as an intermediary between the interposer and the external environment. By having a higher thermal expansion coefficient than the interposer, the molding member absorbs and distributes thermal stress, preventing stress concentration at the interposer and protecting the integrated chip structure.
3Shape
If the molding member has a higher thermal expansion coefficient than the interposer, then warpage is reduced, but material selection becomes more constrained
Solution Approach 1:
The patent changes the key parameter of thermal expansion coefficient by selecting a molding member with a higher coefficient than the interposer. This parameter change enables warpage reduction while the patent provides guidance on suitable material combinations, maintaining practical versatility in material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes stress concentration and enhances the productivity and reliability of the semiconductor package by effectively managing thermal expansion-related warpage.
Implementation Method 1
a thermal expansion coefficient of the molding member is greater than a thermal expansion coefficient of the interposer
Data Source
AI summary
A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.