Interposer-Based IC Packaging for Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit packaging technologies fail to achieve high density, low cost, and improved performance, particularly in portable electronic devices, as they do not adequately address the need for increased integration and cost reduction while maintaining reliability and efficiency.
Innovation Solution
The proposed solution involves an integrated circuit packaging system that includes an interposer with a base integrated circuit and leads attached to its bottom side, where the interposer top side is exposed after encapsulation, providing improved warpage control, reduced package height, and increased standoff area for accommodating more die stacks, thus enhancing integration and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional integrated circuit packaging is used, then manufacturing is simpler, but packaging density and integration are insufficient
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: interposer layer, base integrated circuit layer, lead layer, and encapsulation layer. This segmentation allows each component to be optimized independently while achieving high overall integration density.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional stacked packaging by positioning components at different vertical levels (z-dimension). The interposer, base IC, and leads are arranged in multiple layers, enabling higher packaging density without increasing footprint area.
2Length of stationary object
If package height is reduced for portability, then device thickness decreases, but warpage control becomes difficult
Solution Approach 1:
The interposer acts as a counterweight structure that compensates for warpage forces. By positioning the interposer with specific mass distribution and structural rigidity, it counteracts the warping tendencies of the stacked components, maintaining stability despite reduced package height.
Solution Approach 2:
The packaging system uses composite material construction with the interposer providing mechanical stability and warpage resistance. The combination of different materials with complementary properties enables thin profile while maintaining structural integrity and minimizing warpage.
3Quantity of substance
If more die stacks are accommodated for higher integration, then integration capability increases, but standoff area requirements increase
Solution Approach 1:
The patent utilizes vertical stacking in the z-dimension to accommodate multiple die layers. By arranging die stacks vertically on the interposer rather than spreading them horizontally, the design achieves high integration capability while minimizing the required standoff area on the package substrate.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.