Interposer Bump Pad Layout Using Library-Based Pitch Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity of semiconductor device designs leads to higher time and cost requirements due to manual layout determination and conformance to design rules, which is inefficient for multifunctional semiconductor devices.
Innovation Solution
A method for designing and manufacturing an interposer that involves generating a library of pads with different dimensions, determining the layout of bump pads based on target dimensions and pitch distances, and placing them at specific points to ensure electrical connectivity and spacing greater than the minimum pad interval, facilitating efficient electrical connections between semiconductor chips and external bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual layout determination and design rule conformance checking are used for interposer design, then design accuracy can be maintained, but design time and cost increase significantly
Solution Approach 1:
The system performs self-service by automatically determining bump pad layouts and checking design rule conformance without manual intervention. The processor automatically selects bump pad patterns from a library, determines their positions, and verifies design rules, enabling the design system to serve itself and eliminate time-consuming manual operations while maintaining accuracy through systematic automated procedures
Solution Approach 2:
The system changes parameters by automatically selecting appropriate bump pad patterns from a library based on pitch distances and pad intervals, and by programmatically determining layout positions. This parameter-driven approach replaces manual layout determination with automated parameter selection and calculation, significantly reducing design time while maintaining precision through systematic parameter management
2Adaptability or versatility
If manual layout determination is used for multifunctional semiconductor devices, then design flexibility can be maintained, but design complexity increases
Solution Approach 1:
The design process is segmented into distinct automated steps: selecting bump pad patterns from a library, determining layout positions based on pitch distances, and checking design rule conformance. This segmentation transforms the complex manual design process into manageable automated tasks, reducing overall design complexity while maintaining flexibility through programmable parameters and selectable patterns
Solution Approach 2:
The system introduces dynamics by enabling automated adaptation of bump pad layouts based on varying pitch distances and pad intervals. The processor dynamically selects appropriate patterns from the library and calculates optimal positions, allowing the design to adapt to different functional requirements without manual reconfiguration, thereby maintaining flexibility while reducing complexity through systematic automation
3Productivity
If bump pads are placed closer together to increase connectivity, then electrical connectivity improves, but manufacturing precision requirements increase
Solution Approach 1:
The system performs preliminary action by pre-defining a library of bump pad patterns with various pitch distances and dimensions. This library is prepared in advance with patterns optimized for different spacing requirements, allowing the automated selection process to choose appropriate pre-validated patterns that achieve high connectivity while maintaining manufacturable spacing, thereby increasing productivity without excessively tightening precision requirements
Solution Approach 2:
The system manages the trade-off by changing parameters through automated selection of bump pad patterns with optimized pitch distances from the library. The processor selects patterns that achieve the required connectivity density while maintaining spacing within manufacturing capabilities, using parameter-driven selection to balance productivity and manufacturing precision without requiring extreme precision for high-density layouts
Data Source
AI summary
Provided is a method of manufacturing an interposer, the method including providing a design of the interposer, and manufacturing the interposer based the design of the interposer, wherein the interposer includes bump pads contacting external connection bumps and spaced apart from each other at a distance greater than a pad interval, wherein the providing the design of the interposer includes generating a library including information about library pads having different dimensions, and determining a layout of the bump pads corresponding to each of the pad regions, wherein the layout of the bump pads corresponding to each of the pad regions is determined by selecting a library pad from among the library pads having a target dimension based on the pad interval and a pitch distance of target points in each of the pad regions, and placing the selected library pad at the target points in each of the pad regions.