Interposer Package Layout With Embedded Passive and Bridge Paths
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Solution Overview
Problem
There is an ongoing need for packages with improved performance and reduced size, particularly in integrating components like substrates and interposers.
Innovation Solution
The integration of a passive device and a bridge within a package interposer, which includes metallization portions and an encapsulation layer, enhances electrical performance and reduces the overall form factor without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are integrated within the package interposer, then performance is improved and size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the passive device and bridge into the package interposer structure, creating an integrated component arrangement. The passive device is positioned within the interposer and electrically connected to metallization portions, while the bridge provides additional electrical paths, all without requiring separate mounting structures or increasing overall package dimensions.
Solution Approach 2:
The passive device is nested within the package interposer volume, utilizing the interposer's internal space rather than adding external components. The bridge structure is also integrated within the interposer framework, allowing multiple functional elements to occupy the same spatial envelope and achieve high integration density.
2Volume of moving object
If the package size is reduced, then form factor is improved, but available space for components decreases
Solution Approach 1:
The patent transitions from planar component arrangement to three-dimensional integration within the interposer. The passive device is positioned at specific locations within the interposer volume, and the bridge provides vertical and lateral electrical paths, effectively utilizing z-dimension space to accommodate multiple components in a compact footprint.
Solution Approach 2:
Multiple functional components are nested within the interposer structure, with the passive device and bridge integrated into the same volume. This nesting approach allows the package to maintain reduced external dimensions while accommodating sufficient internal space for all required components through efficient spatial utilization.
Data Source
AI summary
A package comprising a first integrated device; a second integrated device; and a package interposer coupled to the first integrated device and the second integrated device. The package interposer comprises a first metallization portion; a second metallization portion; a first encapsulation layer coupled to the first metallization portion and the second metallization portion; and a passive device located at least partially in the first encapsulation layer. The first encapsulation layer and the passive device are located between the first metallization portion and the second metallization portion.