Interposer Patterned Sites for Chiplet Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multi-chip integration techniques face challenges in power consumption, design complexity, and proprietary elements, leading to inadequate performance.
Innovation Solution
An interposer with patterned sites for mounting integrated circuit chiplets, featuring standardized connection points that allow interchangeable mounting and customization, coupled with signal routes and circuit elements for enhanced interoperability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing multi-chip integration techniques (multi-chip modules, SiP, 3D stacking) are used, then chip integration is achieved, but power consumption increases and design complexity increases
Solution Approach 1:
The system is divided into separate chiplets that can be independently designed, manufactured, and tested. Each chiplet performs a specific function and can be mounted on the interposer independently, reducing overall design complexity while maintaining integration capability
Solution Approach 2:
An interposer with standardized connection points serves as an intermediary between chiplets. This mediator provides a common interface that simplifies the integration process, allowing different chiplets to be combined without requiring custom design for each combination
2Adaptability or versatility
If existing multi-chip integration techniques are used, then chip integration is achieved, but proprietary/custom elements increase design complexity
Solution Approach 1:
The interposer provides universal connection points that can interface with multiple types of chiplets. The standardized interface design allows the same interposer structure to work with different chiplet configurations, eliminating the need for proprietary custom elements and simplifying manufacturing
Solution Approach 2:
The connection points are designed with standardized geometric and electrical parameters that can be replicated across multiple interposers. This standardization of parameters enables consistent manufacturing processes and reduces the need for custom tooling or specialized assembly procedures
3Reliability
If non-standardized chip interfaces are used, then chiplet functionality is achieved, but interchangeability and reconfigurability are limited
Solution Approach 1:
The standardized connection points on the interposer are designed to accommodate multiple chiplet types with the same interface standard. This universality enables chiplets to be interchanged and reconfigured without requiring changes to the interposer or other chiplets, maintaining functionality while enhancing adaptability
4Adaptability or versatility
If complex multi-chip integration designs are implemented, then integration capability is achieved, but time-to-market increases
Solution Approach 1:
Chiplets can be independently designed, manufactured, and tested before final assembly on the interposer. This preliminary development of individual components parallelizes the development process and reduces the overall time-to-market for the integrated system
Solution Approach 2:
By dividing the system into independent chiplets with standardized interfaces, the development process is modularized. Teams can work on different chiplets simultaneously, and proven chiplets can be reused across different products, significantly reducing development time
Data Source
AI summary
The described embodiments include an interposer with signal routes located therein. The interposer includes a set of sites arranged in a pattern, each site including a set of connection points. Each connection point in each site is coupled to a corresponding one of the signal routes. Integrated circuit chiplets may be mounted on the sites and signal connectors for mounted integrated circuit chiplets may coupled to some or all of the connection points for corresponding sites, thereby coupling the chiplets to corresponding signal routes. The chiplets may then send and receive signals via the connection points and signal routes. In some embodiments, the set of connection points in each of the sites is the same, i.e., has a same physical layout. In other embodiments, the set of connection points for each site is arranged in one of two or more physical layouts.