Interposer PCB Stack-Up for Battery Space in Compact Electronics
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Solution Overview
Problem
Existing electronic devices face challenges in miniaturization and battery capacity enhancement due to the limited space on printed circuit boards (PCBs), making it difficult to accommodate larger batteries.
Innovation Solution
Incorporating an interposer with via spaces between circuit boards to reduce PCB area and create additional space for battery extension by laminating the boards, allowing for a larger battery capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the PCB is formed in a single layer, then the manufacturing process is simple, but it is difficult to secure space for extending battery capacity
Solution Approach 1:
The patent transitions from a single-layer PCB to a multi-layer laminated structure by adding a second circuit board and interposer layer vertically above the first circuit board. This dimensional change creates additional space within the same footprint area, enabling battery extension without increasing the overall device area while maintaining manufacturing feasibility through standard lamination processes.
Solution Approach 2:
The interposer is nested between the first and second circuit boards, with vias penetrating through the interposer to establish electrical connections. This nesting arrangement allows the interposer to serve multiple functions: providing mechanical support, enabling vertical signal routing, and creating the necessary space for battery extension, thereby resolving the contradiction between manufacturing simplicity and space utilization.
2Volume of stationary object
If the PCB area is reduced to increase battery capacity, then battery extension space is secured, but the mounting space for components and vias is reduced
Solution Approach 1:
By moving component mounting and via formation to a vertical multi-layer configuration, the patent secures horizontal space for battery extension. The first and second circuit boards provide separate mounting surfaces for components, while the interposer provides via structures for electrical connections, thereby maintaining component mounting capability while creating battery space in the horizontal plane.
Solution Approach 2:
The patent segments the circuit board function across multiple layers: the first circuit board carries certain components, the interposer provides via connections, and the second circuit board carries additional components. This segmentation allows each layer to be optimized for its specific function, ensuring adequate component mounting space on each board while collectively providing the necessary electrical connections and battery extension space.
3Volume of stationary object
If an interposer is inserted between circuit boards to reduce PCB area, then battery extension space is created, but the device structure becomes more complex
Solution Approach 1:
The interposer is designed to perform multiple functions simultaneously: it provides mechanical support between circuit boards, establishes electrical connections through vias, and creates the necessary space for battery extension. This multi-functionality reduces the need for separate components and simplifies the overall structure despite the multi-layer configuration, thereby resolving the contradiction between structure complexity and space utilization.
Solution Approach 2:
The patent merges the functions of mechanical support, electrical connection, and space creation into a single interposer component. By combining these functions, the design avoids adding separate structural elements that would increase complexity, thereby achieving battery extension space while maintaining relatively simple device architecture.
Data Source
AI summary
An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.