Interposer PCB Standoff for Power Module Co-Planarity
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Solution Overview
Problem
The increasing demand for smaller footprint power modules with higher signal output pins and current carrying capacity poses challenges in co-planarity and cost, particularly when using bottom side surface mount technology, as traditional interconnect pins and land grid array pads are not cost-effective and do not meet the required power density and co-planarity standards.
Innovation Solution
The use of an interposer printed circuit board with top and bottom side pads, including vias for signal paths and solder bumps, provides a standoff to prevent electrical components from contacting the motherboard, allowing for tighter pin spacing and reduced assembly costs by replacing multiple pin placements with a single interposer PCB, which also improves thermal and electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional interconnect pins and land grid array pads are used, then assembly cost is reduced, but co-planarity and power density requirements cannot be met
Solution Approach 1:
An interposer PCB is introduced as an intermediary component between the power module and the motherboard. This interposer provides the necessary standoff height to achieve co-planarity with bottom-side mounted SMT components while maintaining cost-effective manufacturing processes. The interposer acts as a mediator that resolves the conflict between precision requirements and manufacturing simplicity.
2Area of moving object
If the footprint area is reduced, then power density is improved, but the number of signal output pins and current carrying capacity must increase
Solution Approach 1:
The patent utilizes the vertical dimension by implementing bottom-side mounting of SMT components on the power module. This allows the module to achieve higher pin density and current carrying capacity within a reduced footprint area by exploiting the third dimension (height/standoff) rather than being constrained to the planar area only.
3Area of moving object
If surface mount technology components are placed on the bottom side, then power density is improved, but standoff for clearance is required
Solution Approach 1:
The interposer PCB serves multiple functions simultaneously: it provides the necessary standoff height for bottom-side SMT component clearance, establishes co-planarity with the motherboard, and maintains electrical connections. This multi-functional approach eliminates the need for separate standoff structures, reducing overall device complexity while achieving the desired power density.
Data Source
AI summary
Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.