Interposer Structure for Reliable Stacked PCB Solder Connections
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Solution Overview
Problem
The increasing slimness of electronic devices leads to narrower spacing between electronic components, causing electrical open or short phenomena during the soldering process due to inadequate physical contact between conductive terminals.
Innovation Solution
An electronic device with an interposer featuring a dielectric substrate and conductive terminals, including a connection failure prevention structure and solder overflow prevention structure around the terminals to ensure reliable electrical connections between stacked printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic components are arranged in a slim configuration with narrow spacing, then the device thickness is reduced, but electrical open or short phenomena occur during soldering due to inadequate physical contact between conductive terminals
Solution Approach 1:
The patent introduces a support structure as an intermediary element between adjacent conductive terminals. This support structure prevents excessive solder flow and maintains proper spacing between terminals during the soldering process, thereby preventing electrical short phenomena while enabling reliable electrical connections in slim device configurations
Solution Approach 2:
The support structure is pre-formed and positioned around conductive terminals before the soldering process. This preliminary arrangement ensures that when solder is applied, the terminals maintain adequate spacing and physical contact, preventing both electrical open and short phenomena from the outset
2Length of moving object
If terminal size is reduced or spacing is narrowed to accommodate slim device design, then device thickness is reduced, but physical contact between terminals through free solder cannot be performed properly
Solution Approach 1:
The support structure serves as a mediator that controls solder flow during the soldering process. By positioning the support structure around conductive terminals, the patent ensures that free solder can properly bridge terminals without excessive flow, maintaining manufacturing precision even in narrow spacing configurations
Solution Approach 2:
The patent modifies the physical parameters of the soldering process by introducing the support structure, which changes the flow characteristics of solder. This allows precise control over solder placement and contact between terminals, enabling reliable soldering in slim device configurations with reduced terminal spacing
3Reliability
If solder is applied to join conductive terminals in narrow spacing, then electrical connection is achieved, but solder overflow causes electrical short phenomena between adjacent terminals
Solution Approach 1:
The patent converts the potential harmful effect of solder flow into a beneficial outcome by using the support structure to guide and contain solder flow. The support structure prevents solder from overflowing onto adjacent terminals, transforming what could be a source of electrical shorts into a controlled process that ensures reliable electrical connections
Solution Approach 2:
The support structure acts as an intermediary barrier between adjacent conductive terminals, controlling solder flow during the joining process. This mediator prevents solder from bridging adjacent terminals and causing electrical shorts, while still allowing proper solder contact for electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer ensures stable and reliable electrical connections by maintaining proper terminal spacing and preventing solder overflow, enhancing the robustness of electrical connections and preventing connection failures under external impacts.
Implementation Method 1
a pre-solder may contact each other in a molten state through a reflow process by entire or local heating of a printed circuit board at a specific temperature (e.g., 180° C. to 210° C.) to electrically connect the conductive terminals
Implementation Method 2
through a reflow process by entire or local heating of a printed circuit board at a specific temperature (e.g., 180° C. to 210° C.)
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.