Interposer PCB Connection Structure for Solder Open-Short Prevention
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Solution Overview
Problem
The increasing slimness of electronic devices leads to narrower spacing between electronic components, causing electrical open or short phenomena during the soldering process due to inadequate physical contact between conductive terminals, which affects the reliability of connections between printed circuit boards.
Innovation Solution
An electronic device design incorporating an interposer with a dielectric substrate and conductive terminals, featuring a connection failure prevention structure and solder overflow prevention structure around the terminals to ensure stable electrical connections, preventing electrical open and short phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the spacing between electronic components is narrowed to achieve slimness, then the device thickness is reduced, but electrical open or short phenomena occur during soldering due to inadequate physical contact between conductive terminals
Solution Approach 1:
The patent introduces a solder bridge structure as an intermediary element between adjacent conductive terminals. This solder bridge physically connects neighboring terminals, providing a mechanical support and electrical conduction path that prevents both electrical open (by ensuring contact) and electrical short (by controlled connectivity) during the soldering process, thereby resolving the reliability issue caused by narrowed spacing
Solution Approach 2:
The solder bridge is formed in advance before the final reflow soldering process. This preliminary structure ensures that when components are mounted and soldered, the terminals already have a pre-established connection path, preventing connection failures that would otherwise occur due to the narrowed spacing between terminals in slim device designs
2Quantity of substance
If the terminal size is reduced to accommodate narrower spacing, then more terminals can be fitted in the same area, but physical contact between terminals through free solder cannot be performed
Solution Approach 1:
The solder bridge acts as a mediator that compensates for the reduced terminal size. Even though individual terminals are smaller and harder to contact with free solder, the solder bridge provides an extended surface and alternative path for solder attachment, ensuring reliable electrical connection without requiring high precision soldering on the tiny terminals themselves
Solution Approach 2:
Instead of relying solely on direct contact between small terminals in the horizontal plane, the solder bridge extends the connection into a third dimension (vertical height), creating a stepped or elevated connection structure that makes soldering easier and more reliable despite the reduced terminal footprint
3Reliability
If free solders of excessive amount are in physical contact with each other, then electrical short phenomenon occurs, but reducing solder amount may cause electrical open phenomenon
Solution Approach 1:
The solder bridge structure segments the soldering process into distinct zones: the bridge itself provides a controlled connection area, while the spaces between bridges prevent excessive solder from spreading to adjacent terminals. This segmentation allows using adequate solder amount without causing electrical short, as the solder is contained within defined regions
Solution Approach 2:
The solder bridge creates localized areas of enhanced connectivity where solder is needed, while maintaining isolation in surrounding areas. The bridge structure has different properties (higher solder wettability, elevated position) compared to the surrounding board surface, concentrating the solder action where needed and preventing it from causing harmful effects elsewhere
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable electrical connections between printed circuit boards by maintaining a consistent distance and preventing solder overflow, enhancing the structural integrity and operational stability of the electronic device.
Implementation Method 1
a pre-solder may contact each other in a molten state through a reflow process by entire or local heating of a printed circuit board at a specific temperature (e.g., 180° C. to 210° C.) to electrically connect the conductive terminals
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.