Interposer Photonics Package Layout for Short Optical Signal Paths
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high integration and short signal distances between photonics integrated circuit chips and logic chips, particularly in data-intensive environments like data centers and communication infrastructure.
Innovation Solution
A semiconductor package design incorporating a package substrate, interposer with through electrodes and cavities, and photonics modules that facilitate optical signal communication, including photonics integrated circuit chips and electronic integrated circuit chips, with optimized placement and optical transmissive layers to minimize overlap and enhance signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photonics integrated circuit chips and logic chips are integrated in a semiconductor package, then data processing capability is improved, but signal distance and signal interference become critical issues
Solution Approach 1:
An interposer is introduced as an intermediary component between the photonics integrated circuit chip and the logic chip. The interposer includes through electrodes that establish electrical connections and cavities that accommodate photonics modules, thereby mediating the interaction between the two chips and reducing direct signal interference while maintaining short signal paths.
Solution Approach 2:
The patent utilizes three-dimensional packaging architecture where photonics modules are positioned in cavities within the interposer, creating vertical stacking arrangements. This dimensional approach allows multiple chips and modules to coexist in a compact space with optimized signal paths, transforming the traditional planar layout into a multi-layered structure that reduces signal interference.
2Productivity
If multiple chips and modules are integrated in a compact package, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The semiconductor package is segmented into distinct functional modules: the interposer with through electrodes, cavities for photonics modules, the photonics integrated circuit chip, and the logic chip. This segmentation allows each component to be manufactured and tested separately before final assembly, thereby reducing overall manufacturing complexity while achieving high integration density.
Solution Approach 2:
The photonics modules are nested within the cavities of the interposer, which itself is integrated into the semiconductor package structure. This nested arrangement maximizes space utilization and integration density while maintaining a hierarchical manufacturing approach where each nested level can be processed independently.
3Reliability
If through electrodes are used for electrical connections, then signal transmission is improved, but manufacturing precision requirements increase
Solution Approach 1:
The through electrodes are pre-formed in the interposer before the final assembly of the semiconductor package. This preliminary action allows for precise positioning and alignment to be established early in the manufacturing process, ensuring reliable signal transmission while managing the precision requirements through controlled fabrication steps.
Solution Approach 2:
The interposer serves as an intermediary structure that houses the through electrodes and provides a stable platform for connecting the photonics integrated circuit chip and the logic chip. This intermediary role allows the through electrodes to be precisely positioned relative to each other while accommodating tolerances in the positioning of the attached chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high integration and short signal distances, enhancing data processing capabilities and reducing signal interference, thereby improving performance in data centers and communication infrastructure.
Implementation Method 1
an optical transmissive layer on the upper surface of the photonics integrated circuit chip
Data Source
AI summary
A semiconductor package may include a package substrate, an interposer on the package substrate, photonics modules in the interposer and configured to perform communication based on optical signals, and a semiconductor chip on the interposer. A core substrate of the interposer may include through electrodes and cavities, where the through electrodes may extend from an upper surface of the core substrate to a lower surface of the core substrate. The cavities may extend from the upper surface of the core substrate to an inner portion of the core substrate where the through electrodes are not disposed. One of the photonics modules may be in each of the cavities. Each photonics module may include a photonics integrated circuit chip, and an electronic integrated circuit chip and an optical transmissive layer on an upper surface of the photonics integrated circuit chip.