Interchangeable Interposer Pin Redistribution for Common Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor device packaging technology requires unique substrates for each controller with different pin-out patterns, leading to increased costs, complexity, and inventory management challenges due to the need for multiple substrates, even when the memory die configuration remains the same.
Innovation Solution
The use of an interposer with a universal pin-out pattern that redistributes the pin-out pattern of the controller to a common substrate, allowing a single substrate configuration to accommodate multiple controllers with varying dimensions and pin-out patterns, while embedding traces in a flexible layer to meet fine pitch requirements and reduce package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a unique substrate is fabricated for each controller with different pin-out patterns, then the controller can be properly connected, but the cost, complexity, and inventory management burden increase due to requiring multiple substrate types
Solution Approach 1:
The substrate is designed with a universal cavity configuration that can accommodate multiple interposer types with different pin-out patterns. The cavity includes a cavity floor and vertical sidewalls that provide a standardized interface, allowing the same substrate to work with various controllers through interchangeable interposers rather than requiring unique substrates for each controller type.
Solution Approach 2:
An interposer is introduced as an intermediary component between the controller and the substrate. The interposer contains redistribution layers that map the controller's specific pin-out pattern to the universal substrate interface, acting as a mediator that enables compatibility without requiring the substrate itself to be customized for each controller type.
2Manufacturing precision
If traces are embedded in a flexible layer on the substrate, then fine pitch requirements can be met and package height can be reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The trace routing is moved from the substrate plane to a flexible layer that can be folded or bent to achieve the required fine pitch connections. This dimensional change allows traces to reach fine pitch locations by utilizing the third dimension (vertical/flexible layer space) rather than being constrained to the substrate surface plane, thereby achieving fine pitch capability without proportionally increasing package height.
Data Source
AI summary
Semiconductor device assemblies having redistribution structures, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor device assembly includes a substrate, a controller, and an interposer. The substrate has a top surface and a bottom surface. A cavity extends below the top surface. The controller has a first pin-out pattern. The interposer has a top surface with the first pin-out pattern that is directly connected to the controller and a bottom surface that has a second pin-out pattern. The interposer interconnects the first and second pin-out patterns, and the interposer and the second pin-out pattern are configured to be directly attached to a surface of the substrate in the cavity.