Interposer Structure With Photosensitive Polymer for Lower-Cost Packaging
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Solution Overview
Problem
The complex fabrication process of interposers for semiconductor packages results in high fabrication costs, making it desirable to simplify the process and reduce costs.
Innovation Solution
The development of an interposer with a simplified fabrication process, featuring an interposer substrate with through-electrode structures, a connection terminal structure, and a photosensitive polymer layer, which reduces fabrication complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex fabrication process is used to manufacture interposers, then the structural integrity and electrical connection reliability are improved, but the fabrication cost increases
Solution Approach 1:
The patent combines the passivation layer and photosensitive polymer layer into a single integrated structure. The passivation layer serves dual purposes: protecting the through-electrode structures and providing a base for the photosensitive polymer layer. This merging reduces the number of separate fabrication steps and material deposition processes, thereby lowering manufacturing costs while maintaining both structural integrity and electrical connection reliability
Solution Approach 2:
The photosensitive polymer layer performs multiple functions simultaneously: it acts as an insulating layer to prevent electrical shorting between adjacent through-electrode structures, provides mechanical support to maintain structural integrity, and serves as a bonding interface for subsequent packaging processes. This multi-functionality eliminates the need for separate layers for each purpose, simplifying the fabrication process and reducing costs
2Ease of manufacture
If a simplified fabrication process is used to manufacture interposers, then the fabrication cost is reduced, but the manufacturing precision and structural integrity may deteriorate
Solution Approach 1:
The passivation layer is formed on the through-electrode structures before the photosensitive polymer layer is applied. This preliminary action ensures that the through-electrode structures are already protected and properly prepared, maintaining precise alignment and structural integrity from the outset. The pre-formed passivation layer serves as a stable foundation that prevents subsequent processing steps from compromising the precision of the through-electrode structures
Solution Approach 2:
The passivation layer acts as an intermediary between the through-electrode structures and the photosensitive polymer layer. It provides a controlled interface that ensures precise positioning and proper adhesion, maintaining manufacturing precision while allowing the simplified two-layer structure to reduce fabrication costs. The intermediary layer prevents direct contact between potentially incompatible materials and ensures smooth transitions between different functional zones
3Reliability
If multiple separate layers are used for passivation and photosensitive functions, then the reliability is improved, but the device complexity and fabrication process complexity increase
Solution Approach 1:
The patent merges the passivation function and photosensitive function into an integrated two-layer structure where the passivation layer and photosensitive polymer layer work together as a unified system. This merging reduces the number of separate fabrication processes needed while maintaining the reliability benefits of having both protective and photosensitive functionalities. The integrated approach simplifies the overall device structure and reduces fabrication process complexity
Solution Approach 2:
Each layer is designed with multi-functionality: the passivation layer provides both structural protection and a preparation surface for the photosensitive layer, while the photosensitive polymer layer provides both optical responsiveness and additional insulation. This multi-functionality reduces the total number of layers needed compared to separate dedicated layers for each function, thereby reducing device complexity and fabrication process complexity while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified fabrication process enables the production of interposers with reduced costs while maintaining the necessary electrical connections and structural integrity for semiconductor packages.
Implementation Method 1
a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure
Data Source
AI summary
Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.