Interposer Prime Area Test Circuit for Defect Detection
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Solution Overview
Problem
The semiconductor industry faces challenges in producing integrated circuits with interposers due to thermal expansion mismatches causing stress and defects, and existing quality assurance testing methods are inadequate as they are typically performed outside the prime area of the interposer, leading to potential defects going undetected until after packaging is complete.
Innovation Solution
Incorporating a prime area test circuit within the interposer, formed by electrically connecting a portion of through vias in series, which allows for electrical interrogation during the manufacturing process, ensuring quality control within the critical connection areas and enabling detection of defects earlier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If quality assurance testing is performed in the frame area of the interposer, then testing can be conducted, but the test results do not accurately monitor product quality because the frame area does not form electrical connections for the integrated circuit
Solution Approach 1:
The patent introduces a test circuit as an intermediary element that is electrically connected to the prime area through vias. This test circuit acts as a mediator between the testing process and the critical prime area connections, allowing quality assurance to be performed on the actual functional connections without disrupting production. The test circuit includes test vias that are electrically connected to the prime area, enabling accurate monitoring of the critical connection quality.
2Reliability
If sample interposers are electrically interrogated on a periodic basis after packaging, then quality assurance is performed, but defects in interposers produced between passing and failing tests may go undetected
Solution Approach 1:
The patent implements preliminary quality assurance by forming a test circuit during the interposer fabrication process itself, before the integrated circuit chips are packaged. This test circuit is created in advance and can be electrically interrogated at any stage during production. By performing testing preliminarily rather than periodically after packaging, the system enables continuous monitoring and immediate detection of defects, eliminating the time delay inherent in periodic sampling.
3Area of stationary object
If the interposer includes solder points, electrically conductive through vias, and insulating components to redistribute contact areas, then contact points are redistributed to a larger area, but large coefficient of thermal expansion mismatches induce stress that can produce defects
Solution Approach 1:
The patent applies local quality by creating specific test structures in particular locations within the interposer. The test circuit is formed in a test area that is separate from but electrically connected to the prime area through vias. This allows localized testing of the critical connection points without requiring the entire interposer to be tested, and enables targeted monitoring of areas most susceptible to thermal stress effects.
Data Source
AI summary
Methods of producing integrated circuits with interposers and integrated circuits produced from such methods are provided. In an exemplary embodiment, a method of producing an integrated circuit includes producing an interposer with an insulation plate and a plurality of through vias passing through the insulation plate. The interposer has a prime area and an in prime area. A prime area test circuit is formed in the prime area, where the prime area test circuit includes a portion of the plurality of through vias that are electrically connected in series.