Interposer Package Structure With Protection Layer Against Delamination
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Solution Overview
Problem
Current semiconductor device packaging technologies face challenges in efficiently integrating and protecting interposer structures with varying coefficients of thermal expansion, leading to delamination and cracks in underfill structures due to material mismatch.
Innovation Solution
The method involves forming an interposer structure with through vias and conductive pads, attaching semiconductor dies via flip-chip bonding, encapsulating with an insulating encapsulant, and creating a protection layer with a polymer or dielectric material to isolate the interposer from external components, thereby managing thermal expansion differences and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer structure is integrated with semiconductor dies and underfill materials, then electrical connection and mechanical support are achieved, but delamination and cracks occur due to mismatched thermal expansion coefficients
Solution Approach 1:
The patent introduces a protection layer as an intermediary component between the interposer structure and the underfill material. This protection layer has thermal expansion properties that are intermediate between those of the interposer and the underfill, thereby reducing the thermal expansion mismatch and preventing delamination and cracks that would otherwise occur at the interface between materials with vastly different thermal expansion coefficients
Solution Approach 2:
The patent modifies the thermal expansion parameter profile across the package structure by inserting a protection layer with specifically selected thermal expansion characteristics. This creates a gradual transition in thermal expansion properties from the interposer through the protection layer to the underfill, reducing stress concentration and preventing structural failure during thermal cycling
2Reliability
If through vias and conductive pads are formed in the interposer structure, then electrical connectivity is established, but the structure becomes more complex and susceptible to damage
Solution Approach 1:
The patent performs preliminary protective actions by forming the protection layer over the interposer structure before subsequent packaging steps. This pre-established protection layer shields the through vias and conductive pads from mechanical damage during underfill material application and from environmental factors during operation, thereby protecting the complex electrical interconnection structure without requiring additional protective measures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of semiconductor devices by isolating the interposer structure from underfill materials with mismatched thermal expansion coefficients, reducing the risk of delamination and cracks, and improving the overall package structure's integrity.
Implementation Method 1
managing thermal expansion differences and preventing delamination
Data Source
AI summary
A package structure includes a circuit substrate and a semiconductor device. The semiconductor device is disposed on and electrically connected to the circuit substrate. The semiconductor device includes an interconnection structure, a semiconductor die, an insulating encapsulant, a protection layer and electrical connectors. The interconnection structure has a first surface and a second surface. The semiconductor die is disposed on the first surface and electrically connected to the interconnection structure. The insulating encapsulant is encapsulating the semiconductor die and partially covering sidewalls of the interconnection structure. The protection layer is disposed on the second surface of the interconnection structure and partially covering the sidewalls of the interconnection structure, wherein the protection layer is in contact with the insulating encapsulant. The electrical connectors are disposed on the protection layer, wherein the interconnection structure is electrically connected to the circuit substrate through the plurality of electrical connectors.