Interposer Contacts with Redundant Circuit Paths
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Solution Overview
Problem
Conventional interposer assemblies with short, closely spaced single circuit path contacts experience signal impedance and degradation at high frequencies due to radiating energy as 'antennas', leading to cross-talk and signal loss.
Innovation Solution
The introduction of interposer assemblies with contacts featuring two separate circuit paths between contact points, reducing inductance and contact resistance, and eliminating the electrical contact stub that contributes to signal degradation, using a conventional dielectric plate without the need for specialized manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single circuit path contacts with stubs are used, then manufacturing is simpler, but signal loss and cross-talk increase at high frequencies
Solution Approach 1:
The contact is segmented into two separate circuit paths between the contact points, eliminating the single stub structure. Each path provides a redundant route for current flow, preventing the formation of antenna-like stubs that radiate energy and cause signal loss at high frequencies.
Solution Approach 2:
The electrical parameters of the contact are changed by introducing a second circuit path, which alters the inductance and resistance characteristics. This parameter change reduces the antenna effect and minimizes signal degradation while maintaining manufacturing simplicity.
2Device complexity
If single circuit path contacts are used, then device complexity is reduced, but signal impedance and degradation worsen at high frequencies
Solution Approach 1:
The single circuit path is segmented into two separate paths, creating a redundant structure that improves signal transmission reliability. The segmentation eliminates the antenna effect while maintaining relatively simple contact geometry suitable for conventional manufacturing.
Solution Approach 2:
The redundant circuit path acts as a cushion against signal degradation by providing an alternative current path. This beforehand cushioning compensates for the inherent inductance and resistance issues that would otherwise cause signal impedance and degradation at high frequencies.
3Ease of operation
If contacts with stubs extending beyond contact points are used, then contact insertion is easier, but inductance and contact resistance increase
Solution Approach 1:
The contact structure is segmented into two paths that terminate at the contact points without extending beyond them as stubs. This segmentation eliminates the inductive antenna effect while maintaining ease of insertion through the standard contact geometry.
Solution Approach 2:
The potential harm of extended stubs acting as antennas is converted into benefit by using those same structural elements to create two separate circuit paths. The paths are configured to terminate properly, converting what would be harmful radiation into useful redundant current paths that reduce overall inductance and resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The redundant circuit paths significantly reduce signal loss and cross-talk, enhancing high-frequency signal transmission by eliminating antenna effects and maintaining reliable connections across substrates.
Implementation Method 1
Each contact in the assembly has two separate circuit paths between contact points which engage opposed substrate pads. The two circuit paths in each contact reduce inductance and contact resistance.
Implementation Method 2
The portions or stubs of the contacts extending from points to free ends do not carry current. These stubs extend outside of the electrical current path or loop for the contact and act as antennas. The antennas radiate energy and increase signal loss, particularly at high signal frequencies.
Data Source
AI summary
The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.