Terminal Interposer Flow Channels for Solder-Stable Circuit Modules
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Solution Overview
Problem
Existing power amplifier modules face challenges in providing thermal paths that extend away from the system PCB, requiring improved configurations for input/output signals, bias voltages, and ground references.
Innovation Solution
Incorporation of terminal interposers with mold flow channels and encapsulant material to enhance the connection between module substrates, reducing solder bridging and weeping during reflow processes, and ensuring robust electrical and thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulant material is applied over the module substrate without mold flow channels, then the connection between terminal interposers and module substrate is formed, but solder bridging and weeping occur during reflow processes causing unreliable connections
Solution Approach 1:
The terminal interposer is segmented by forming mold flow channels that divide the encapsulant material into distinct regions. These channels create physical barriers that prevent solder from flowing freely between adjacent terminals during reflow, thereby eliminating solder bridging and weeping while maintaining reliable electrical connections.
2Adaptability or versatility
If thermal path extends away from the system PCB, then thermal management flexibility is improved, but providing adequate ground reference and bias voltages becomes more difficult
Solution Approach 1:
The terminal interposer acts as an intermediary component between the module substrate and the external system. It provides integrated terminals that simultaneously deliver ground references, bias voltages, and signal connections while accommodating flexible thermal path configurations. The mold flow channels in the interposer further mediate by managing solder flow patterns to ensure reliable electrical connections despite the complex thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more reliable and solid connection, minimizing delamination, solder bridging, and weeping, while maintaining effective signal and thermal management.
Implementation Method 1
mold flow channels, which provide a robust connection by allowing encapsulant material to flow into these channels
Data Source
AI summary
A circuit module includes a module substrate, a terminal interposer, and encapsulant material. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The terminal interposer is coupled to the mounting surface of the module substrate. The terminal interposer includes a dielectric body and a conductive terminal. The dielectric body has top, bottom, and side surfaces, and one or more mold flow channels extending from at least one of the side surfaces into the dielectric body. The conductive terminal is embedded within the dielectric body and extends between the top and bottom surfaces of the dielectric body. A proximal end of the conductive terminal is coupled to a first conductive pad of the plurality of conductive pads. The encapsulant material covers at least a portion of the mounting surface of the module substrate and extends into the one or more mold flow channels.