Interposer Seating Indication Using Distributed Presence Pins
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Solution Overview
Problem
Ensuring proper seating and electrical contact between large processor packages and sockets is challenging due to variances in coplanarity and socket force frame mechanisms, limiting detection accuracy with traditional single presence pin techniques.
Innovation Solution
Implementing two or more resistors connected to first electrical contacts of a semiconductor device package and a logic circuit to indicate the status of these connections based on voltage measurements, allowing for detailed detection of contact issues across multiple regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single presence pin is used to detect processor seating, then the device complexity is reduced, but the measurement precision and detection accuracy deteriorate due to coplanarity variances in large packages
Solution Approach 1:
The patent divides the detection system into multiple independent presence pins distributed across different regions of the processor package. Each presence pin independently monitors contact status in its specific region, allowing the system to segment the overall detection task into multiple localized measurements. This segmentation enables detection of regional contact issues while maintaining manageable circuit complexity through modular pin design.
Solution Approach 2:
The patent transitions from a single-point detection approach to a multi-dimensional detection framework by distributing presence pins across multiple spatial locations and regions. This dimensional expansion from one detection point to multiple distributed points enables comprehensive monitoring of coplanarity variations across the entire processor package surface, improving measurement precision without proportionally increasing complexity.
2Measurement precision
If multiple presence pins across multiple regions are used to improve detection accuracy, then the measurement precision improves, but the device complexity increases
Solution Approach 1:
The presence pins are designed to serve multiple functions: they detect seating status, monitor contact quality, and identify regional issues simultaneously. By making the detection system multi-functional, the patent achieves high measurement precision through comprehensive monitoring while avoiding the need for separate dedicated detection circuits for each function, thereby managing overall device complexity.
Solution Approach 2:
The detection system uses the existing electrical contacts and voltage sources already present in the processor-socket interface to monitor contact status. The presence pins leverage the natural electrical characteristics of the interface itself rather than requiring entirely separate active monitoring circuits, allowing the system to self-monitor using its inherent components and reducing additional complexity.
3Ease of manufacture
If traditional single presence pin technique is used, then the ease of manufacture is improved, but the reliability of seating detection deteriorates
Solution Approach 1:
The presence pins are pre-positioned and pre-configured during the manufacturing process to monitor specific critical regions. This preliminary placement allows the detection system to be built-in from the start, maintaining ease of manufacture while the distributed architecture provides redundant detection paths that improve reliability through multiple independent monitoring points.
Solution Approach 2:
The system incorporates feedback mechanisms where the voltage levels at presence pin locations continuously reflect the actual contact status. This feedback allows the detection system to reliably identify seating issues by monitoring electrical characteristics in real-time, improving detection reliability while using simple passive voltage monitoring that maintains manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances detection of proper processor and socket contact, improves High Volume Manufacturing quality, and facilitates at-scale debugging by identifying specific contact issues with heatsink or force frame actuated sockets.
Implementation Method 1
configuring two or more resistors to connect two or more first electrical contacts of a semiconductor device package to a first voltage source
Implementation Method 2
indicating a status of a first connection of the two or more first electrical contacts to a second voltage source based on a voltage of a second connection of the two or more resistors to the first voltage source
Data Source
AI summary
A method can include receiving, in a socket, a semiconductor device package, wherein the socket includes two or more second electrical contacts positioned to connect two or more first electrical contacts of the semiconductor device package to a second voltage source. The method can also include connecting, by two or more resistors, the two or more first electrical contacts of the semiconductor device package to a first voltage source. The method can additionally include indicating, by a logic circuit, a status of a first connection of the two or more first electrical contacts to the second voltage source based on a voltage of a second connection of the two or more resistors to the first voltage source. Various other methods and systems are also disclosed.