Interposer Segmentation for IC Die Routing
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Solution Overview
Problem
The maximum size of integrated circuit dies is limited by the reticle size of photomasks in the fabrication process, restricting the manufacturing of larger devices on a single die, and existing interposers do not effectively route electrical connections between multiple integrated circuit chips.
Innovation Solution
The method involves fabricating an interposer with two integrated circuit portions on a single semiconductor substrate, where one portion is electrically isolated from the other along a specific axis, allowing for electrical coupling of multiple integrated circuit dies across a perpendicular axis, using through-silicon vias and interconnection traces to connect the dies and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If integrated circuit dies are manufactured using conventional photomask reticle sizes, then manufacturing precision is maintained, but the maximum size of integrated circuit dies is limited
Solution Approach 1:
The interposer is divided into multiple separate interposer portions that are fabricated independently on a semiconductor substrate and then combined. Each portion can be manufactured within conventional reticle size limits while the overall interposer achieves a larger effective size by assembling these segments together.
Solution Approach 2:
The patent transitions from manufacturing a single large integrated circuit die in two dimensions to creating a three-dimensional structure where multiple smaller dies are mounted on an interposer substrate, achieving larger effective circuit size through vertical stacking and substrate integration rather than horizontal expansion.
2Reliability
If existing interposers are used to route electrical connections, then some electrical coupling is achieved, but effective routing between multiple integrated circuit chips is not realized
Solution Approach 1:
Different regions of the interposer are designed with specialized functions - some areas contain through-silicon vias for vertical electrical connections, others contain pad structures for die attachment, and isolation regions provide electrical separation. This localized functional differentiation enables effective routing between multiple chips with distinct electrical requirements.
Solution Approach 2:
The interposer serves as an intermediary substrate between multiple integrated circuit dies, providing through-silicon via connections that mediate electrical coupling between chips that would otherwise be difficult to connect directly. The interposer translates and routes signals between different die configurations.
Data Source
AI summary
Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a single semiconductor substrate. A second integrated circuit portion is disposed on a second location of the single semiconductor substrate, where the second integrated circuit portion is electrically isolated from the first integrated circuit portion along a first axis. The first and second integrated circuit portions are configured to provide an electrical coupling to two or more corresponding top die integrated circuits across a second axis that is perpendicular to the first axis.