Interposer Packaging with Segmented Perimeter Regions
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that balances miniaturization, high input/output density, reliability, and cost-effectiveness while ensuring testability and performance, particularly in portable devices, where existing solutions have not adequately addressed these needs.
Innovation Solution
The system employs an interposer with device contacts, interconnect contacts, and test pads, where the test pads are located in a perimeter region encompassing the device contacts, allowing for robust connections and reliable testing, and eliminates encapsulation to reduce costs and thickness, using a laminated substrate or printed circuit board for increased reliability and reduced complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional IC packaging structures are used, then manufacturing simplicity is maintained, but package size and thickness cannot be sufficiently reduced
Solution Approach 1:
The packaging system is divided into distinct functional layers: interposer substrate, integrated circuit, and encapsulant. The interposer itself is segmented into different perimeter regions (device perimeter, test perimeter, interconnect perimeter) with specialized contacts in each region, allowing independent optimization of each segment's function while contributing to overall miniaturization.
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional stacked architecture where the interposer substrate provides vertical separation between device contacts, test pads, and interconnect contacts. This dimensional reorganization enables high I/O density while maintaining testability and reducing overall package footprint.
2Quantity of substance
If component miniaturization is increased, then packaging density improves, but manufacturing precision requirements increase
Solution Approach 1:
The interposer substrate is pre-configured with device contacts, test pads, and interconnect contacts in specific perimeter regions before the integrated circuit is mounted. This preliminary arrangement of contacts and interconnect structures establishes precise alignment references that guide subsequent assembly steps, ensuring accurate positioning even as component sizes are reduced to increase packaging density.
3Quantity of substance
If I/O density is increased, then functionality improves, but testability becomes more difficult
Solution Approach 1:
The interposer substrate provides different local qualities in different perimeter regions: device perimeter regions contain contacts optimized for device connection, test perimeter regions contain pads optimized for testing with appropriate spacing and accessibility, and interconnect perimeter regions contain contacts for external connections. This spatial differentiation allows high I/O density in the device region while maintaining testability in the dedicated test perimeter region.
4Length of moving object
If encapsulation is eliminated to reduce cost and thickness, then manufacturing cost and package thickness decrease, but reliability may be compromised
Solution Approach 1:
The interposer substrate acts as an intermediary element that provides mechanical support, electrical interconnection, and structural integrity without requiring traditional encapsulation. The laminated substrate construction with multiple layers and embedded interconnects provides the necessary protection and stability, enabling thin-profile packages while maintaining reliability through the interposer's inherent structural properties rather than through encapsulation.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device contacts at a device perimeter region of the interposer with the device perimeter region within the interior of the interconnect perimeter region, and the test pads at a test perimeter region of the interposer with the test perimeter region encompassing the device perimeter region; and mounting an integrated circuit over the device contacts.