Interposer with Segmented Wiring for Signal Transmission
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Solution Overview
Problem
Existing interposers face challenges in achieving low wiring resistance for high-speed and large-volume signal transmission due to the limitations of traditional wiring methods, which are not adequately addressed in current technologies.
Innovation Solution
The interposer design features a support substrate with a first inorganic insulation layer and a second organic insulation layer, where the first wiring connects lands within the inorganic layer and the second wiring, with a longer length and greater thickness, connects pads across both layers, reducing resistance and enabling efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wiring methods are used in interposers, then manufacturing is simpler, but wiring resistance is too high for high-speed signal transmission
Solution Approach 1:
The wiring structure is segmented into two distinct layers: a first wiring layer formed in an inorganic insulation layer using semiconductor manufacturing techniques, and a second wiring layer formed in an organic insulation layer using conventional PCB techniques. This segmentation allows each layer to be optimized for its specific function while maintaining overall manufacturability.
Solution Approach 2:
The interposer uses a composite insulation structure combining inorganic insulation material (for the first wiring layer requiring low resistance) and organic insulation material (for the second wiring layer requiring flexibility and ease of manufacturing). This composite approach enables both high-performance signal transmission and ease of manufacture.
2Length of stationary object
If wiring length is increased to connect pads, then signal transmission distance is improved, but wiring resistance increases
Solution Approach 1:
The wiring path is extended into the vertical dimension by utilizing multiple layers. The first wiring layer provides short horizontal connections within the inorganic insulation layer, while the second wiring layer provides additional routing paths in the organic insulation layer, effectively distributing the wiring length across three-dimensional space rather than extending it in a single plane.
Solution Approach 2:
Different wiring layers are assigned different functional qualities: the first wiring layer in the inorganic insulation layer is optimized for low resistance and high-speed signals, while the second wiring layer in the organic insulation layer is optimized for routing flexibility and mechanical protection. Each layer's local properties are tailored to its specific requirements.
Data Source
AI summary
An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.