Interposer-Mounted Semiconductor Module for High Power Density Cooling
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Solution Overview
Problem
Existing semiconductor power modules face high development efforts and limited flexibility due to traditional construction methods, hindering the increase in power density and system output.
Innovation Solution
An electronic module design featuring a semiconductor package on an interposer layer connected to a fluid heat sink, with an encapsulant covering the die carrier and electrical conductor, allowing for improved heat dissipation and modular scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional semiconductor bare die assembly construction methods are used, then manufacturing simplicity is maintained, but development effort increases and flexibility decreases
Solution Approach 1:
The semiconductor module is divided into separate functional components: semiconductor dies mounted on a carrier board, which is then encapsulated. This segmentation allows independent optimization of each component and facilitates modular assembly, thereby increasing flexibility while maintaining manufacturing simplicity through standardized processes.
Solution Approach 2:
An encapsulant material is introduced as an intermediary substance that bonds the semiconductor dies to the carrier board and provides structural support. This intermediary enables flexible configuration of semiconductor components while simplifying the manufacturing process through a single encapsulation step.
2Power
If power density of individual modules is increased, then system output power increases, but heat dissipation requirements increase
Solution Approach 1:
Heat is extracted from the semiconductor dies through thermal vias and heat sinks that are integrated into the carrier board structure. This extraction of heat away from the high-power-density semiconductor components enables higher power operation without excessive temperature rise.
Solution Approach 2:
The carrier board utilizes composite material structures with high thermal conductivity pathways (such as metal traces, thermal vias filled with conductive material, and attached heat sinks) combined with electrically insulating materials. This composite approach enables efficient heat dissipation while maintaining electrical functionality, allowing increased power density.
3Adaptability or versatility
If modular approach with standard size modules is used, then system scalability is improved, but power density of individual modules is limited
Solution Approach 1:
The carrier board is designed as a universal platform that can accommodate different types and numbers of semiconductor dies in various configurations. The standardized encapsulation process and modular structure allow the same basic module design to be scaled from low to high power applications by simply changing the semiconductor component arrangement, thereby achieving both scalability and high power density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances flexibility and reduces development efforts while increasing power density by effectively dissipating heat through the interposer layer and heat sink, facilitating modular expansion.
Implementation Method 1
an heat sink through which a cooling medium can flow, wherein the interposer layer is disposed on the heatsink
Implementation Method 2
a heat sink through which a cooling medium can flow
Data Source
AI summary
An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.