Interposer Mediator for High-Density Semiconductor Package Stacking
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high-density chip stacking with package-on-package (PoP) technology due to a higher probability of yield drop compared to one-chip packaging, necessitating improved methods to increase yield and density while maintaining defect rates in end products.
Innovation Solution
A semiconductor package design that includes a first package with at least one semiconductor chip, a second package with an external connection terminal, and an interposer for electrical connection between the two packages, featuring a stepped structure and specific connection pads and leads to facilitate bonding and electrical connectivity, along with a bonding layer and molding to secure the interposer and chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are vertically stacked to achieve high-density chip stacking, then the chip density is improved, but the yield probability decreases
Solution Approach 1:
An interposer is introduced as an intermediary component between the first and second packages. The interposer includes an intermediate connector with exposed end portion and protruding end portion that facilitates electrical connection between packages while improving assembly alignment and yield. The interposer acts as a mediator that resolves the alignment and connection challenges in multi-chip stacking.
2Quantity of substance
If package-on-package technology is used to achieve high-density stacking, then the chip stacking density is improved, but the manufacturing complexity increases
Solution Approach 1:
The package structure is segmented into distinct components: first package, interposer with intermediate connector, and second package. This segmentation allows each component to be manufactured and tested separately, then assembled together, which simplifies the overall manufacturing process while achieving high-density stacking.
Solution Approach 2:
The interposer serves as an intermediary component that simplifies the connection interface between packages. The intermediate connector with its exposed and protruding end portions provides standardized connection points that reduce manufacturing complexity by enabling modular assembly.
3Ease of manufacture
If conventional chip stacking methods are used, then the manufacturing process is simpler, but package warpage and form factor limitations occur
Solution Approach 1:
The interposer acts as a mediator that distributes mechanical stress and improves thermal management in the stacked package structure. This reduces package warpage while maintaining the benefits of vertical stacking, achieving better form factor without excessive manufacturing complexity.
Data Source
AI summary
A semiconductor package includes a first package including at least one first semiconductor chip; a second package including an external connection terminal and at least one second semiconductor chip, the second package being stacked on the first package; and an interposer disposed between the first and second packages and connected to the external connection terminal to electrically connect the first and second packages to each other. The interposer comprises an intermediate connector having an exposed end portion to which the second package is electrically connected via the external connection terminal and a protruding end portion lower than the exposed end portion to which the first package is electrically connected.