Interposer With Actuators For Endoscope Sensor Alignment
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Solution Overview
Problem
Endoscope imaging sensors face challenges in maintaining precise alignment and stereoscopic image quality due to manufacturing variability and thermal expansion issues, especially when shrunk in size for smaller diameters, leading to misalignment and degraded image quality.
Innovation Solution
The use of an interposer with self-alignment techniques to mount multiple image sensors, along with actuators that allow for precise positioning and movement of the sensors relative to each other and their optics, reduces thermal expansion mismatch and maintains alignment, enabling enhanced calibration and super resolution imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple image sensors are mounted directly on the endoscope tip to reduce diameter, then the endoscope size is reduced, but manufacturing variability and thermal expansion cause misalignment between sensors
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the image sensors and the endoscope tip. This interposer serves as a stable mounting platform that maintains precise relative positions of multiple image sensors, eliminating alignment issues caused by direct mounting on the endoscope tip. The interposer acts as a mediator that decouples the sensors from thermal and mechanical stresses in the endoscope structure.
Solution Approach 2:
The system is segmented into distinct functional modules: the interposer substrate holding multiple image sensors, the endoscope tip, and the lens assembly. This segmentation allows each component to be optimized independently - the interposer can be designed specifically for precise sensor mounting while the endoscope tip focuses on minimization and the lens assembly on optical performance.
2Length of moving object
If image sensors are shrunk in size for smaller endoscope diameter, then the endoscope is more compact, but thermal expansion mismatch degrades alignment stability
Solution Approach 1:
The material composition and thermal properties of the interposer substrate are specifically selected and engineered to match the thermal expansion characteristics of the mounted image sensors. By changing the physical parameters (thermal expansion coefficient, mechanical properties) of the interposer, the system compensates for thermal effects and maintains alignment stability even when sensors are shrunk in size.
3Measurement precision
If actuators are added for precise sensor positioning, then calibration and super resolution capabilities are enhanced, but device complexity increases
Solution Approach 1:
Static image sensors are transformed into dynamically adjustable components through the integration of actuators. These actuators enable real-time repositioning of the sensors along the optical axis and laterally, allowing the system to adapt its configuration for different imaging modes including calibration, super-resolution, and stereoscopic imaging. This dynamic capability enhances measurement precision while the modular design keeps complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise positioning of image sensors, maintains stereoscopic image quality, and reduces thermal-induced misalignment, improving the overall performance and reliability of endoscope imaging systems.
Implementation Method 1
thermal expansion matching
Data Source
AI summary
Apparatuses and methods for an interposer for integration of multiple image sensors are disclosed herein. An example apparatus includes an interposer including laterally spaced first and second windows, and first and second image sensors disposed on the interposer over the first and second windows, respectively. The interposer including conductive conduits formed in or on to provide electrically conductive paths there through with the first and second image sensors coupled to the conductive conduits. The first and second image sensors laterally spaced by a gap, and an active area of the first and second image sensors to receive incident light through the respective first and second windows, where a perspective of the first image is different than a perspective of the second image sensor based at least in part on the gap.