High Density Multi-Component Package With Interposer Serial Connectivity
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Solution Overview
Problem
Current electronic component packaging technologies face challenges in achieving serial connectivity while minimizing the footprint on circuit boards, as stacked components provide only parallel connections, which limits their applications and increases space requirements.
Innovation Solution
A high-density multi-component package is developed, utilizing interposers between electronic components to enable serial connectivity, with active and mechanical interposers forming connections through vias or conductive wraps, allowing for both serial and parallel configurations and reducing the surface area occupied on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are stacked to minimize footprint, then area occupied on circuit board is reduced, but serial connectivity is lost and only parallel connections are provided
Solution Approach 1:
The patent introduces an interposer as an intermediary component between stacked electronic components. The interposer enables serial connectivity by providing conductive paths that connect terminals of adjacent components in series, while the components themselves remain physically stacked. This resolves the contradiction by allowing both compact stacking and serial connectivity configuration through the mediating interposer structure.
Solution Approach 2:
The patent segments the connection function by separating the mechanical stacking function from the electrical connection function. The interposer is divided into distinct regions: mechanical support structures that enable stacking, and conductive trace patterns that enable serial connectivity. This segmentation allows independent optimization of both stacking density and connectivity configuration.
2Adaptability or versatility
If components are connected in series to provide functionality, then application versatility is improved, but space required for mounting increases
Solution Approach 1:
The patent transitions from planar serial connection layout to three-dimensional stacked configuration with interposer-mediated connections. Instead of arranging components in a linear or grid pattern on the board surface, components are stacked vertically with the interposer enabling serial electrical connectivity through conductive traces. This dimensional change allows serial connectivity without increasing the two-dimensional footprint on the circuit board.
Solution Approach 2:
The patent implements a nested structure where the interposer is positioned within the stack of electronic components, with conductive traces routed through the interposer to connect adjacent components. The interposer itself may contain nested conductive layers and vias that route signals between components. This nesting approach consolidates multiple connection functions within the vertical stack, minimizing the mounting area while enabling serial connectivity.
Data Source
AI summary
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.