Interposer Shield for EMI Suppression in IC Packaging
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Solution Overview
Problem
The challenge in integrated circuit packaging is to increase density while minimizing electromagnetic interference (EMI) and reducing manufacturing costs and complexity, especially in compact devices where EMI shielding is necessary without using expensive conductive enclosures.
Innovation Solution
An integrated circuit packaging system that includes a bottom substrate with a first integrated circuit die and an interposer with a shield formed on an intermediate substrate, using a wire-in-film adhesive for attachment, which serves as both an EMI shield and a redistribution layer, reducing the need for additional manufacturing equipment and processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metallic or conductive enclosures are used to isolate integrated circuits for EMI shielding, then EMI suppression is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the EMI shield with the interposer substrate by forming a conductive shield layer directly on the interposer. This integration eliminates the need for separate metallic enclosures and reduces the number of discrete components, thereby improving EMI suppression while decreasing manufacturing complexity
Solution Approach 2:
The interposer is designed to serve multiple functions simultaneously: it acts as both a mechanical support structure for mounting integrated circuits and an EMI shield through its conductive layer. This multi-functionality reduces the overall device complexity by eliminating dedicated shielding components
2Object-affected harmful factors
If conductive enclosures are used for EMI shielding, then EMI suppression is improved, but manufacturing cost increases
Solution Approach 1:
By integrating the EMI shield functionality into the interposer substrate through a conductive layer, the patent eliminates the need for separate expensive metallic enclosures. This consolidation reduces material costs and manufacturing expenses while maintaining effective EMI suppression
Solution Approach 2:
The patent uses a conductive layer formed on the interposer substrate as a cost-effective alternative to expensive metallic enclosures. This approach provides adequate EMI shielding at a lower manufacturing cost
3Object-affected harmful factors
If separate EMI shields and adhesive layers are used in addition to the interposer, then EMI suppression is improved, but package height increases
Solution Approach 1:
The patent merges the EMI shield with the interposer substrate by forming a conductive layer directly on it, eliminating the need for separate shield components and additional adhesive layers. This integration maintains EMI suppression effectiveness while reducing the overall package height
Solution Approach 2:
The interposer with its conductive layer serves as both the mechanical support and the EMI shield, eliminating the need for additional shielding components and adhesive layers that would increase package height
4Quantity of substance
If more integrated circuits are packed into a single package to increase density, then integrated circuit density is improved, but EMI interference increases
Solution Approach 1:
The interposer with its conductive layer serves as both a mechanical support for multiple integrated circuits and an EMI shield that protects them from interference. This allows high-density packaging while maintaining signal integrity
Solution Approach 2:
The conductive layer on the interposer changes the electromagnetic environment by providing a grounded shielding surface, thereby reducing EMI interference between closely packed integrated circuits and enabling higher density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the height of the final package, decreases manufacturing costs, and simplifies the production process by integrating the shield directly into the interposer, thereby enhancing EMI suppression and radiation attenuation without the need for extra adhesive layers or metal shields.
Implementation Method 1
attaching the interposer to the first integrated circuit die with the wire-in-film adhesive
Implementation Method 2
forming a shield on the intermediate substrate... effectively reduces the height of the final package, decreases manufacturing costs, and simplifies the production process by integrating the shield directly into the interposer, thereby enhancing EMI suppression and radiation attenuation
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.