Interposer Shielding Wall Layout for Compact RF Signal Routing
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Solution Overview
Problem
Existing electronic devices with high-frequency signal transmission require multiple interconnection arrays, leading to an undesirable increase in device size due to the need for characteristic impedance matching.
Innovation Solution
Incorporating a first interposer with a first interconnection array connected to ground and a first shielding wall, along with a second interconnection array between the shielding wall and the first interconnection array, configured to transmit signals while using an electrical shielding layer to prevent electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If three or more arrays of interconnections are utilized in an interposer to meet characteristic impedance, then signal transmission quality is improved, but device size increases
Solution Approach 1:
The patent extracts the shielding function from a traditional multi-array interconnection structure and implements it through a dedicated shielding wall configuration. By separating the signal transmission function (first interconnection array) from the shielding function (shielding wall with second interconnection array), the design achieves characteristic impedance control without requiring three or more interconnection arrays, thereby reducing device size while maintaining signal transmission quality
Solution Approach 2:
The shielding wall acts as an intermediary element between the first interconnection array (signal transmission) and the ground reference. The second interconnection array embedded in the shielding wall provides an intermediate shielding layer that controls characteristic impedance and prevents electromagnetic interference, enabling effective signal transmission without requiring multiple full interconnection arrays
2Reliability
If shielding structures are added to prevent electromagnetic interference, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The patent merges the shielding wall structure with the interconnection array by embedding the second interconnection array directly within the shielding wall. This integration allows the shielding wall to simultaneously provide electromagnetic shielding and signal transmission functions, reducing device complexity compared to having separate shielding structures and interconnection arrays
Solution Approach 2:
The shielding wall is designed to perform multiple functions: it provides electromagnetic shielding, transmits signals through the embedded second interconnection array, and helps establish characteristic impedance control. This multi-functionality reduces the need for additional dedicated components, thereby reducing overall device complexity while maintaining signal integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the electronic device while maintaining signal integrity by reducing attenuation and distortion of high-frequency signals, such as RF signals, and protecting against electromagnetic interference.
Implementation Method 1
The first electrical shielding layer is adjacent to the first edge of the interposer... The ground connection and the electrical shielding layer are configured to prevent the signal connection from electromagnetic interference
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.