Interposer-Based Low-Area Overhead Connectivity for SIP Modules
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Solution Overview
Problem
The increasing complexity and miniaturization of electronic devices require space-efficient and customizable interconnect structures that can easily modify connections between system-in-a-package modules and other boards or components, as conventional connector systems are cumbersome and difficult to customize.
Innovation Solution
The use of interposers with customizable contact placement and interconnect paths formed on printed circuit boards or flexible substrates, allowing for low-area overhead connections between system-in-a-package modules and other boards or components, which can be modified using conventional printed circuit techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connector systems are used to connect system-in-a-package modules to other boards or circuits, then connections can be established, but board space is consumed and height increases
Solution Approach 1:
The interposer is placed directly adjacent to the system-in-a-package module, with contacts positioned very close to the module. The interposer effectively nests the connection function within the minimal space immediately surrounding the module, eliminating the need for separate connector assemblies that would consume additional board area.
Solution Approach 2:
The invention transitions from traditional lateral connector placement to a configuration where the interposer is positioned in the vertical dimension adjacent to the module. By placing the interposer next to the module with contacts extending toward it, the solution utilizes the third dimension (height/depth) rather than consuming horizontal board space.
2Reliability
If connector systems are used to connect system-in-a-package modules, then connections can be established, but the connector height may match or exceed the module height
Solution Approach 1:
The interposer is positioned adjacent to the module with its contacts extending toward the module's contact array. This nesting arrangement allows the connection function to be achieved within the vertical envelope already occupied by the module, preventing additional height increase that would occur with separate connector assemblies.
3Reliability
If conventional connector systems are used, then connections can be established, but they are difficult to modify when design changes are necessary
Solution Approach 1:
The interposer is designed as a separate, modular component with its own contact array and interconnect paths. This segmentation allows the interposer to be independently modified, replaced, or customized without affecting the system-in-a-package module itself, enabling design changes to be made by swapping or reconfiguring just the interposer component.
Solution Approach 2:
The interposer serves as an intermediary component between the module and the second board. This intermediary role allows design changes to be absorbed and implemented at the interposer level, protecting the core module from modification while still enabling adaptability. The interposer can be customized with different contact configurations, trace layouts, and connection patterns to accommodate various design requirements.
4Adaptability or versatility
If customized connector systems are desired, then specific uses can be accommodated, but acquisition and modification are difficult due to third-party provision
Solution Approach 1:
By segmenting the connection system into a standalone interposer component, the invention enables each interposer to be independently customized for specific applications. This segmentation allows different interposers with tailored contact configurations, trace patterns, and electrical characteristics to be manufactured for different uses without requiring custom connector assemblies from third parties.
Solution Approach 2:
The interposer design provides a universal platform that can be adapted for multiple specific applications. The same basic interposer structure and manufacturing process can be used to create customized solutions for different system requirements, eliminating the need for separate third-party connector development for each application.
Data Source
AI summary
Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.