Interposer Slanted Sidewall Alignment for Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of semiconductor device packages poses challenges due to misalignment issues during manufacturing, particularly when forming cavities in interposers to accommodate semiconductor devices, which can lead to performance adverse effects.
Innovation Solution
The use of an interposer with a slanted sidewall that matches the semiconductor device's guide structure, providing a reinforced engagement and mitigating warpage stress, along with anisotropic removal techniques to form spaces for precise placement and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a space or cavity is formed in the interposer to accommodate semiconductor devices, then miniaturization of the semiconductor device package is achieved, but misalignment occurs during manufacturing which adversely affects performance
Solution Approach 1:
The patent applies preliminary action by pre-forming guide structures (protrusions and recesses) on the interposer and semiconductor device surfaces before the placement process. These guide structures are created in advance to ensure precise alignment during manufacturing, solving the misalignment problem that would otherwise occur when forming cavities in the interposer for miniaturization.
2Length of moving object
If the interposer is made thinner to meet miniaturization trends, then package size is reduced, but handling issues arise during manufacturing
Solution Approach 1:
The patent employs composite materials by combining the interposer with reinforcing structures and guide features that provide both mechanical strength for handling and precise alignment capabilities. The interposer integrates multiple functional elements including guide protrusions, recesses, and engagement features that collectively enhance manufacturability while maintaining thin profile for miniaturization.
3Strength
If a slanted sidewall with angle of 90° to 120° is used in the interposer, then structural reinforcement is achieved and warpage stress is mitigated, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the sidewall angle of the guide structures to fall within the range of 90° to 120°. This specific angular parameter provides the optimal balance between structural reinforcement for warpage mitigation and manufacturability, avoiding excessive complexity while achieving the desired mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances alignment accuracy and structural reinforcement, reducing stress and improving yield performance by ensuring precise interconnection designs and robust bonding within the semiconductor device package.
Implementation Method 1
anisotropically removing a portion of a carrier to form a space
Data Source
AI summary
A semiconductor device package includes an interposer and a semiconductor device. The interposer has a sidewall defining a space. The semiconductor device is disposed within the space and in contact with the sidewall. An interposer includes a first surface, a second surface and a third surface. The first surface has a first crystal orientation. The second surface is opposite the first surface and has the first crystal orientation. The third surface connects the first surface to the second surface, and defines a space. An angle defined by the third surface and the first surface ranges from about 90° to about 120°.