Interposer Slot Design for Void-Free Semiconductor Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor package manufacturing techniques often result in voids around electrical connectors due to incomplete filling of molding compounds, leading to unreliable connections between stacked semiconductor substrates.
Innovation Solution
Incorporating an interposer element with slots between rows of pads, allowing molding compounds and fillers to flow through and expand from the central area to the periphery, thereby reducing or eliminating voids and enhancing connector reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor package manufacturing techniques are used, then the manufacturing process is simple, but voids form around electrical connectors due to incomplete filling of molding compounds
Solution Approach 1:
The interposer element is segmented by introducing slots that divide the structure into regions, allowing molding compound to flow through and fill voids more effectively. The slots create pathways for material flow and enable better distribution of encapsulant around electrical connectors.
Solution Approach 2:
The interposer element incorporates slot structures that function as controlled porosity features, allowing molding compound and fillers to penetrate through the interposer thickness and fill voids that would otherwise form around electrical connectors during encapsulation.
2Reliability
If slots are added to the interposer element, then voids are reduced and connection reliability improves, but the manufacturing process becomes more complex
Solution Approach 1:
The slots are formed in the interposer element before the encapsulation process, pre-positioning pathways for molding compound flow. This preliminary structuring ensures that during subsequent encapsulation, the compound can naturally flow through the slots and fill voids without requiring additional complex manufacturing steps.
3Manufacturing precision
If molding compound flows through slots, then complete filling is achieved and voids are eliminated, but the encapsulation process requires precise control
Solution Approach 1:
The slots act as intermediary channels that guide and control the flow of molding compound during encapsulation. By providing defined pathways, the slots mediate between the encapsulation process and the final filling result, ensuring complete void elimination while maintaining process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability of electrical connections by ensuring complete filling and reducing voids around connectors, enhancing the overall performance and stability of semiconductor packages.
Implementation Method 1
flowing an encapsulant through the slot
Data Source
AI summary
A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.