Interposer Solder Containment for Semiconductor Chip Insulation
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Solution Overview
Problem
Conventional semiconductor devices face issues with solder creeping and spreading over semiconductor chips, leading to decreased adhesion between the solder and sealing member, stress on bonded parts, and potential insulation failure due to temperature changes.
Innovation Solution
The semiconductor device incorporates interposers with penetration holes filled with solder, allowing the solder to creep upward and concentrate in these holes, reducing the spread over the chip surfaces and enhancing adhesion with a sealing member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder is applied to bond semiconductor chips and interposers, then bonding strength is improved, but solder creeps upward and spreads over chip surfaces causing adhesion loss and insulation failure
Solution Approach 1:
The patent divides the solder application zones by introducing penetration holes in the insulating layer, separating the bonding function (at post electrodes) from the chip surface. This segmentation prevents solder from spreading over the chip surface while maintaining bonding strength through concentrated solder in the penetration holes.
Solution Approach 2:
The patent applies solder locally in the penetration holes rather than allowing it to spread broadly. The penetration holes create localized solder concentration zones that provide strong bonding at specific points (post electrodes and conductor layers) while preventing harmful spread to other areas like chip surfaces and sealing member interfaces.
2Area of stationary object
If solder spreads over chip surfaces, then bonding area is increased, but adhesion between solder and sealing member decreases and stress concentrates on bonded parts
Solution Approach 1:
The penetration holes segment the solder bonding area into discrete locations rather than allowing continuous spread. This creates multiple localized bonding points that maintain strong adhesion while distributing stress more effectively across the structure.
Solution Approach 2:
The penetration holes act as intermediaries that guide and contain solder flow. Instead of solder spreading freely over chip surfaces, the penetration holes mediate the solder's path, directing it to bond between post electrodes and conductor layers while preventing contact with chip surfaces and sealing member interfaces.
3Reliability
If penetration holes are provided in insulating layer, then solder adhesion and reliability are improved, but device complexity increases
Solution Approach 1:
The penetration holes serve multiple functions simultaneously: they provide pathways for solder flow, act as barriers to prevent solder spread, create localized bonding zones, and maintain insulating layer integrity. This multi-functionality achieves reliability improvement without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves reliability by preventing gaps and insulation failures, ensuring stable bonding even with temperature changes.
Implementation Method 1
a first penetration hole filled with part of the solder layer
Data Source
AI summary
A semiconductor device includes an insulated circuit substrate, a semiconductor chip, a printed circuit board, an interposer, and a sealing member, the interposer including a plurality of post electrodes each having one end bonded to the semiconductor chip via a solder layer, an insulating layer provided to be separately opposed to the semiconductor chip and provided with a first penetration hole filled with part of the solder layer, and a conductor layer provided to be opposed to the printed circuit board and connected to another end of each of the post electrodes via the insulating layer.