Interposer Spacer Structure for C4 Clearance in Semiconductor Packages
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Solution Overview
Problem
The issue of inadequate standoff height in controlled collapse of chip connection (C4) structures leads to warping of the interposer, potential collision between IC dies and substrates, causing damage and electrical issues in semiconductor packages.
Innovation Solution
Incorporating a spacer structure mounted to the interposer's bottom surface to maintain clearance between the IC die and substrate, reducing the likelihood of interference and enhancing the robustness of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If C4 standoff height is reduced, then device complexity is reduced, but reliability deteriorates due to interposer warping and IC die collision with substrate
Solution Approach 1:
A spacer structure is introduced as an intermediary element between the interposer and substrate. This spacer maintains the necessary clearance to prevent IC die collision with the substrate while the interposer warps, thereby preserving electrical connection reliability without requiring tall C4 standoffs.
Solution Approach 2:
The spacing function is segmented from the C4 standoff structure and assigned to a separate spacer component. This allows the C4 standoffs to be minimized for complexity reduction while the dedicated spacer handles the clearance maintenance function for reliability.
2Manufacturing precision
If C4 standoff height is reduced, then manufacturing precision requirements are reduced, but harmful factors increase due to IC die collision with substrate
Solution Approach 1:
The spacer acts as a mediator that guarantees minimum clearance between the IC die and substrate regardless of variations in C4 standoff height. This eliminates the harmful collision effect while allowing relaxed manufacturing precision for the C4 standoffs.
Solution Approach 2:
The spacer structure provides beforehand cushioning by pre-establishing the clearance buffer zone between the IC die and substrate. This prevents collision damage before it can occur, even when C4 standoff heights vary due to manufacturing tolerances.
3Reliability
If spacer structure is added, then reliability is improved by preventing IC die collision, but device complexity increases
Solution Approach 1:
The spacer structure is designed to perform multiple functions simultaneously: maintaining clearance to prevent collision, accommodating interposer warping, and supporting electrical connections. This multi-functionality justifies the added complexity by delivering comprehensive reliability improvements.
Solution Approach 2:
The spacer structure combines several protective and functional elements into a single integrated component, rather than requiring separate elements for each function. This merging approach minimizes the overall complexity increase while achieving the reliability goals.
Data Source
AI summary
A semiconductor package, which may correspond to a high-performance computing package, includes an interposer over a substrate. A spacer structure is mounted to a bottom surface of the interposer. The spacer structure is configured to maintain a clearance between a bottom surface of an integrated circuit die mounted to the bottom surface of the interposer and a top surface of the substrate to reduce a likelihood of an interference or collision between the integrated circuit die and the substrate. In this way, a likelihood of damage to the integrated circuit die and/or the substrate is reduced. Additionally, a robustness of an electrical connection between the integrated circuit die and the interposer may increase to improve a reliability and/or a yield of the semiconductor package including the spacer structure.