Interposer Stacked Circuit Boards for Miniaturization
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Solution Overview
Problem
The challenge is to minimize the size of electronic devices while ensuring a secure space for internal components, as increased surface area on circuit boards and separate sealing members can lead to larger device sizes and vulnerability to external vibrations.
Innovation Solution
The solution involves using an interposer to stack first and second circuit boards, creating an arrangement space between them for components, and placing sealing members on camera deco areas less affected by external influences to reduce damage from vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate space is secured for the circuit board within the electronic device, then the circuit board can be properly disposed with components, but the size of the electronic device increases
Solution Approach 1:
The circuit board is nested within the housing structure by utilizing the space between the first plate and second plate. The circuit board is disposed to overlap with the camera deco region, effectively nesting multiple components in a layered configuration that maximizes space utilization while minimizing overall device volume.
Solution Approach 2:
The circuit board is positioned in a spatial relationship that overlaps with the camera deco when viewed in the first direction, utilizing the third dimension (depth) to arrange components. This dimensional arrangement allows the circuit board to occupy space that would otherwise be unused, reducing the device's footprint without compromising component disposal.
2Reliability
If a sealing member is installed in a sound hole to block foreign substances, then sealing function is provided, but the sealing member is easily damaged by vibration from external sound
Solution Approach 1:
The sealing member is extracted from the sound hole location and repositioned to the camera deco region. This extraction removes the sealing member from the harmful vibration environment while maintaining its sealing function for blocking foreign substances from entering through the sound hole.
Solution Approach 2:
The camera deco serves as an intermediary structure that is less affected by external vibrations. By placing the sealing member on the camera deco rather than directly in the sound hole, the camera deco acts as a mediator that protects the sealing member from vibration damage while still allowing the sealing function to operate effectively.
3Adaptability or versatility
If multiple components are disposed on a circuit board, then functionality is enhanced, but the surface area of the circuit board increases
Solution Approach 1:
Multiple components including the camera module, flash, and other electronic components are nested in a layered configuration within the space between the first plate and second plate. This nesting allows high-density component integration without increasing the circuit board's surface area, as components are arranged vertically rather than horizontally.
Data Source
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AI summary
Various embodiments related to an electronic device comprising an interposer are described. An electronic device according to one embodiment comprises: a housing; a first circuit substrate and a second circuit substrate arranged in at least a part of the housing and stacked in the housing; a first component and a second component arranged in at least a part of the first circuit substrate and at least a part of the second circuit substrate; and an interposer for electrically connecting the first circuit substrate and the second circuit substrate, wherein the interposer is arranged between the first circuit substrate and the second substrate, and can also form an arrangement space in which the first component and the second component are to be arranged between the first circuit substrate and the second circuit substrate. Other various embodiments are possible.