Interposer-Stacked Semiconductor Package for Short Power Interconnects
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Solution Overview
Problem
Existing power modules face challenges in achieving high performance with a small areal footprint and robust electrical interconnections, particularly in automotive and industrial applications, where they need to manage large voltages and currents efficiently.
Innovation Solution
A semiconductor assembly is developed, comprising an interposer with electrically insulating substrate and contact pads, a semiconductor package with embedded die and exposed terminals, and passive electrical elements, where the interposer facilitates vertical stacking and overlap between the package and passive elements, providing short interconnections and increased reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional planar layout is used for power modules, then manufacturing is simpler, but the areal footprint is larger and electrical interconnections are longer
Solution Approach 1:
The patent transitions from a traditional planar (2D) layout to a three-dimensional stacked architecture. The interposer serves as an intermediate layer that enables vertical stacking of power devices, passive components, and circuit carriers. This dimensional change allows electrical connections to be made through vertical vias and conductors rather than long lateral traces, significantly reducing the areal footprint while maintaining robust electrical interconnections.
2Productivity
If vertical stacking with interposer is used, then space-efficiency and connection length are improved, but manufacturing complexity increases
Solution Approach 1:
The power module is segmented into distinct functional layers separated by an interposer. Each layer (circuit carrier, power devices, passive components, heat sink) can be manufactured and prepared independently, then assembled through controlled processes. The interposer itself is segmented with specific regions for different connection types (through-vias, surface pads, embedded conductors), allowing specialized manufacturing techniques for each segment rather than attempting to create all connections in a single complex process.
Solution Approach 2:
The interposer acts as an intermediary component that simplifies the overall manufacturing process. It provides pre-formed connection points and conductive paths that mediate between the circuit carrier and upper components. This intermediary layer absorbs some of the manufacturing complexity, allowing standard packaging techniques to be used for attaching power devices and passive components to their respective connection points on the interposer, rather than requiring complex direct interconnections between all components.
3Reliability
If longer interconnections are used in traditional layout, then manufacturing is easier, but parasitic inductance increases and performance decreases
Solution Approach 1:
The patent replaces long lateral interconnections with short vertical connections through the interposer. Conductive vias and through-hole fillers provide direct vertical pathways for electrical current, dramatically reducing the length of current paths. This dimensional change in interconnection geometry reduces parasitic inductance and resistance, improving electrical connection reliability and power module performance while managing large voltages and currents efficiently.
Data Source
AI summary
A semiconductor assembly includes an interposer that includes an insulating substrate, a plurality of upper contact pads on an upper surface of the substrate, and a plurality of lower contact pads on a lower surface of the substrate, a semiconductor package that includes a semiconductor die embedded within a package body and a plurality of package terminals exposed from the package body, a first passive electrical element that includes first and second terminals, a first electrical connection between the first terminal of the first passive electrical element and a first one of the lower contact pads via the interposer, a second electrical connection between the second terminal of the first passive electrical element and a first one of the package terminals, and a third electrical connection between a second one of the package terminals and a second one of the lower contact pads via the interposer.