Microelectronic Interposer for Standard Memory Integration
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Solution Overview
Problem
The microelectronic industry faces challenges in producing cost-effective microelectronic packages that can utilize standard, non-specific volatile memory packages with System-on-Chip (SoC) devices, as specifically designed volatile memory packages are expensive and limited in memory options.
Innovation Solution
A microelectronic interposer is used to facilitate electronic communication between a first microelectronic device and at least one second microelectronic device, positioning the second device outside the periphery of the first device, with recesses and projections to achieve desired configurations and reduce height, allowing for the use of standard memory packages in microelectronic packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specifically designed volatile memory packages are used with System-on-Chip devices, then electronic communication is achieved, but cost increases and memory options are limited
Solution Approach 1:
A microelectronic interposer is introduced as an intermediary component between the System-on-Chip device and standard volatile memory packages. The interposer includes a first surface with bond pads for connecting to the SoC device and a second surface with additional bond pads for connecting to standard memory packages. This mediator enables electronic communication while allowing the use of cost-effective, off-the-shelf memory components rather than custom-designed packages.
2Reliability
If specifically designed volatile memory packages are used with System-on-Chip devices, then electronic communication is achieved, but manufacturing cost increases
Solution Approach 1:
The interposer serves multiple functions: it provides electrical interconnection between the SoC device and memory packages, enables the use of standard off-the-shelf memory components, and facilitates flexible package configurations. By creating a universal interface component, the solution allows manufacturers to use inexpensive, readily available memory packages instead of expensive custom-designed packages, thereby reducing manufacturing costs while maintaining reliable electronic communication.
3Adaptability or versatility
If second microelectronic devices are positioned outside the periphery of the first device, then configuration flexibility is improved, but package height increases
Solution Approach 1:
The interposer enables the second microelectronic devices to be positioned in a different spatial arrangement by extending beyond the periphery of the first device in the planar dimension rather than stacking vertically. This dimensional repositioning allows for flexible configurations such as L-shaped or T-shaped arrangements while managing the height increase through the interposer's structure, which distributes the vertical space requirement across its thickness rather than concentrating it in a single stacked layer.
Data Source
AI summary
A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.