Interposer Package Structure With Stop Layer for Low-Resistance TSV Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high electrical resistance of solders used for connecting to through silicon vias (TSVs) in bridge dice hinders power transmission efficiency in electronic packages.
Innovation Solution
A package structure incorporating an encapsulant and an interposer with a conductive through via and a stop layer, where the stop layer acts as an interconnector and heat conductor, reducing electrical resistance and improving heat dissipation, and is manufactured using specific stages of processing to protect the interposer during grinding operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solders are used for electrically connecting to the TSVs, then the TSVs can be connected to other components, but the relatively high electrical resistance of the solders deteriorates the power transmission performance
Solution Approach 1:
The patent introduces a stop layer as an intermediary component between the TSV and the solder. This stop layer is made of a material with lower electrical resistance than traditional solder materials, thereby mediating the electrical connection and reducing power transmission losses while maintaining the mechanical and electrical connection functions.
Solution Approach 2:
The patent changes the material parameter of the connection layer by using a stop layer with different electrical properties (lower resistance) compared to conventional solder materials. This parameter change directly addresses the power transmission efficiency issue while maintaining connection reliability.
2Ease of operation
If the interposer is exposed during grinding operations, then the interposer can be accessed for connections, but the interposer is damaged during the grinding process
Solution Approach 1:
The patent applies a protective coating to the interposer before the grinding process. This preliminary protective action prevents damage during grinding while allowing the interposer to be properly exposed and accessed for connections after the protective coating is removed or penetrated.
Solution Approach 2:
The protective coating serves as a cushioning layer that absorbs or distributes the mechanical stress during grinding operations, preventing direct damage to the interposer structure while still allowing for subsequent access and connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces electrical resistance and enhances heat dissipation, improving the power transmission efficiency and manufacturing yield by using the stop layer as an interconnector and heat conductor, while protecting the interposer during processing.
Implementation Method 1
The pad is adjacent to the second end and configured to receive heat generated from the conductive through via
Implementation Method 2
the stop layer acts as an interconnector and heat conductor, reducing electrical resistance and improving heat dissipation
Data Source
AI summary
A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.