Interposer Substrate for DSM BGA Packaging
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Solution Overview
Problem
The double side mold (DSM) ball grid array (BGA) packaging process is prone to deviations due to laser ablation errors, leading to abnormal solder ball formation and potential mounting defects, and requires varying PCB designs for different IC component arrangements, increasing manufacturing complexity and costs.
Innovation Solution
The use of an interposer substrate with landing pads for electrical connection, which allows for a shared pin or ball map and reduces packaging size, thereby minimizing defects and manufacturing time by protecting internal components and optimizing the pin or ball map arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser ablation is used to expose soldering balls in DSM BGA packaging, then the soldering balls can be exposed to the outside, but deviations in laser ablation cause abnormal solder ball formation and mounting defects
Solution Approach 1:
The patent introduces a lower mold as an intermediary protective layer between the soldering balls and the external environment. This lower mold covers the second surface of the substrate where soldering balls are located, preventing direct exposure while still allowing the electrical connection function to be achieved through the connection members that extend through the mold.
2Manufacturing precision
If the molding on the lower surface is ground to expose soldering balls, then electrical connection is enabled, but components mounted on the lower surface become exposed to external impact
Solution Approach 1:
The lower mold serves as a protective intermediary that covers the components mounted on the second surface of the substrate. It allows the connection members to extend through for electrical connection while maintaining coverage over the sensitive components, thereby protecting them from external impacts.
3Adaptability or versatility
If different companies manufacture ICs with different component arrangements, then various IC functions can be produced, but different ball maps require separate PCB designs increasing manufacturing complexity
Solution Approach 1:
The patent creates a universal lower mold design that can accommodate different IC component arrangements. The mold structure and connection member configuration are designed to be adaptable to various ball maps, allowing a single mold design to serve multiple IC packaging configurations, thereby eliminating the need for separate PCB designs for each IC variant.
4Weight of moving object
If DSM BGA packaging is used to make ICs light and thin, then miniaturization is achieved, but the packaging process becomes complex with multiple steps including molding, grinding, and laser ablation
Solution Approach 1:
The patent combines the protective function and the electrical connection function into a single integrated lower mold structure. This merged design eliminates the need for separate steps of exposing soldering balls through grinding or laser ablation, as the connection members extend directly through the mold during the molding process itself, thereby simplifying the overall packaging process while maintaining the light and thin characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces defect ratios, protects internal components, optimizes package size, and simplifies manufacturing by enabling a shared pin or ball map usage across different IC arrangements, thus reducing manufacturing time and costs.
Implementation Method 1
a connection member comprising a conductive material configured to electrically connect the substrate and the interposer substrate
Data Source
AI summary
Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.