Interposer Substrate Bonding Line Formation for Display Yield
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Solution Overview
Problem
Current methods for manufacturing display devices using interposer substrates are challenging due to the difficulty in forming bonding pads without damaging the existing display device, leading to process complexity and reduced production yield.
Innovation Solution
The method involves forming a bonding connection line, an interposer substrate, and a fan-out region on a carrier substrate, with the bonding connection line being connected to a drive circuit, and then peeling off the carrier substrate, allowing the interposer substrate and thin-film transistor to be sequentially formed, eliminating the need for separate bonding connection line and thin-film transistor preparation on both sides of the interposer substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding pads are formed on the interposer substrate using conventional methods, then electrical connection is achieved, but the existing display device is damaged and production yield is reduced
Solution Approach 1:
The bonding connection line is formed on the carrier substrate before the interposer substrate is attached. This preliminary formation of the bonding connection line avoids the need to form bonding pads on the interposer substrate after the display device is already assembled, thereby preventing damage to the display device and improving production yield
Solution Approach 2:
The bonding connection line is divided into a first lead and a second lead that are insulated from each other. The first lead connects to the gate drive circuit and the second lead connects to the data drive circuit, allowing separate formation and connection processes that avoid damage to the integrated display device
2Reliability
If bonding pads are formed separately on both sides of the interposer substrate, then electrical connections are established, but the fabrication process becomes complex and difficult
Solution Approach 1:
The bonding connection line is merged with the interposer substrate formation process. Both are formed on the same carrier substrate in sequence, eliminating the need for separate bonding pad formation on both sides of the interposer substrate. This integration simplifies the fabrication process while maintaining reliable electrical connections to both gate and data drive circuits
Solution Approach 2:
The bonding connection line is formed on the carrier substrate in a different dimensional sequence - before the interposer substrate is attached. This temporal and spatial reorganization of the formation process reduces complexity by avoiding post-assembly bonding pad formation
3Reliability
If separate preparation of bonding connection line and thin-film transistor is performed on both sides of interposer substrate, then electrical connections are achieved, but production yield is reduced
Solution Approach 1:
The bonding connection line is preliminarily formed on the carrier substrate before the interposer substrate is attached and before the thin-film transistor is fully assembled. This preliminary formation allows for easier correction and rework if connection issues arise, thereby improving production yield while maintaining reliable electrical connections
Solution Approach 2:
The formation of the bonding connection line and the interposer substrate are merged into a single integrated process on the carrier substrate. This eliminates the need for separate preparation steps on both sides of the interposer substrate, reducing process steps and improving production yield
Data Source
AI summary
An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.