Interposer Substrate With Closed-Loop Metal Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing number of components on smartphone main boards due to diversified functions leads to a larger area occupied by interposers, resulting in reduced space efficiency and higher manufacturing costs, along with significant warpage issues due to shape characteristics.
Innovation Solution
A connection substrate and interposer substrate design featuring a metal member with a closed-loop structure and a connection substrate disposed on its side surfaces, including circuit patterns exposed on both surfaces, which also incorporates a ground pattern for electromagnetic interference shielding, reducing the mounting area and minimizing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional interposer with a large empty center is used, then the mounting area is occupied, but the space efficiency is reduced and manufacturing cost increases
Solution Approach 1:
The circuit patterns are arranged in a three-dimensional configuration across multiple layers of the connection substrate, allowing electrical connections to be established without requiring a large planar area. This vertical stacking approach reduces the footprint of the interposer while maintaining all necessary connection functions.
Solution Approach 2:
The connection substrate is designed with a compact structure where circuit patterns and conductive vias are nested within each other across multiple layers. The first and second circuit patterns are positioned on opposite surfaces with intermediate circuit patterns connected through vias, creating a nested arrangement that minimizes the overall area occupied by the interposer.
2Area of stationary object
If a conventional interposer with a large empty center is used, then the mounting area is occupied, but manufacturing cost increases
Solution Approach 1:
The interposer is divided into a connection substrate with distinct functional layers including first circuit patterns, second circuit patterns, and intermediate circuit patterns connected through conductive vias. This segmentation allows for optimized manufacturing processes for each layer while reducing material waste compared to conventional solid-core interposers.
Solution Approach 2:
The connection substrate employs a composite structure combining conductive circuit patterns with insulating substrate material. This composite approach allows precise control over electrical connections while using materials efficiently, reducing both material costs and manufacturing complexity compared to traditional solid metal interposers.
3Area of stationary object
If a conventional interposer with a large empty center is used, then the mounting area is occupied, but warpage problem increases
Solution Approach 1:
The connection substrate is designed with non-uniform distribution of circuit patterns and conductive vias across its layers, placing conductive elements strategically to balance thermal and mechanical stresses. This local optimization of material distribution compensates for stress variations and reduces warpage without requiring a large solid structure.
Solution Approach 2:
The multi-layer composite structure of the connection substrate, combining conductive and insulating materials in specific configurations, provides inherent stress balancing that reduces warpage. The intermediate circuit patterns connected through conductive vias create a distributed stress network that maintains dimensional stability during manufacturing and operation.
Data Source
AI summary
An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.