Interposer Substrate with Protective Film for Chip-Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Monolithic ceramic capacitors in mobile devices experience mechanical distortion due to voltage changes, causing circuit board vibration and reliability issues in mounting, especially with existing interposer structures that require complex land pattern changes and are prone to burrs during manufacturing.
Innovation Solution
A chip-component structure featuring a substrate with parallel electrodes and grooves, overlaid with protective films to prevent burrs and enhance soldering reliability, allowing for easier mounting and reduced distortion effects by controlling the bonding agent distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is used to reduce vibration sound, then the vibration sound is reduced, but the structural design and mounting become more complex
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the monolithic ceramic capacitor and the circuit board. This interposer includes upper electrodes bonded to the capacitor's external electrodes and lower electrodes bonded to the circuit board's mounting lands, with via holes providing electrical connection. The interposer acts as a mediator that isolates the capacitor from direct mounting, thereby reducing vibration sound while maintaining electrical functionality.
2Object-affected harmful factors
If the interposer structure is used, then vibration sound is reduced, but land pattern changes are required which are difficult in high-density packaging
Solution Approach 1:
The interposer substrate serves multiple functions simultaneously: it provides mechanical support for the monolithic ceramic capacitor, establishes electrical connections via via holes, and interfaces with the circuit board's mounting lands. By making the interposer multi-functional, the design avoids the need for complex land pattern changes on the circuit board itself, thereby reducing manufacturing difficulty while maintaining vibration reduction benefits.
3Ease of operation
If electrodes are cut during interposer production, then the interposer can be mounted, but burrs are generated that obstruct soldering and reduce connection reliability
Solution Approach 1:
A protective film is applied to the electrodes of the interposer substrate before the cutting process. This protective film prevents burrs from being generated during cutting operations. By performing this protective action in advance, the subsequent soldering process is not obstructed by burrs, and the connection reliability between the interposer and the circuit board is maintained at a high level.
4Reliability
If protective film is added to prevent burrs, then connection reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The protective film application process is merged with the existing electrode formation process. The protective film is applied to the electrodes during the same manufacturing sequence in which the electrodes are formed and patterned on the interposer substrate. By combining these operations, the protective film is added without requiring a separate, complex manufacturing step, thus maintaining connection reliability while minimizing process complexity.
Data Source
AI summary
In a chip-component structure, a monolithic ceramic capacitor is a structure including a predetermined number of substantially flat internal electrodes stacked on each other. An interposer includes a substrate larger than the outer shape of the monolithic ceramic capacitor. The substrate includes a first major surface on which first front electrodes for use in mounting the monolithic ceramic capacitor are disposed and a second major surface on which first back electrodes for use in connecting to an external circuit board are disposed. The interposer includes a depression in its side surface. The depression includes a wall surface on which a connection conductor is disposed. The front surface of the substrate is overlaid with resist films extending along its edges.