Interposer Support Structure for IC Packaging Reliability
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices, particularly in terms of cooling, reliability, and cost-effectiveness, with issues such as reduced contact area between ball grids and PCBs leading to poorer electrical contacts and detachment risks, and the need for smaller footprints and more robust packages.
Innovation Solution
The integration of a conductive ball with a core body and anti-oxide metallic layer, which provides structural support and adhesion between the interposer and the base substrate, allowing for smaller dimensions and improved reliability, along with an encapsulation for protection, while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the contact area between ball grids and PCBs is reduced to achieve smaller packaging footprints, then the packaging system becomes more compact, but electrical contact quality deteriorates and detachment risk increases
Solution Approach 1:
The patent employs a composite interposer structure combining a substrate layer with an integrated support structure made of conductive material. This composite design reinforces the bonding interface between the ball grid array and the printed circuit board, enabling smaller contact areas while maintaining electrical reliability and mechanical strength through the distributed support provided by the interposer's integrated structure.
2Volume of moving object
If packaging systems are shrunk to achieve smaller footprints, then portability improves, but structural support and mechanical strength are compromised
Solution Approach 1:
The interposer introduces a vertical dimension to structural support by integrating a three-dimensional support structure within the interposer substrate. This allows the bonding interface to extend through the thickness of the interposer, providing enhanced mechanical strength and structural support in the vertical direction while maintaining a compact lateral footprint, thus resolving the contradiction between small size and structural integrity.
3Productivity
If automation is increased to achieve higher production volumes, then productivity improves, but manufacturing complexity and initial cost increase
Solution Approach 1:
The interposer is designed with pre-formed bonding interfaces and integrated support structures that are manufactured as a single component or pre-assembled unit. This preliminary preparation of the interposer allows for automated pick-and-place mounting processes, enabling high-volume production through automation while the modular design keeps the automation requirements manageable by standardizing the interposer component that needs to be handled by automated equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the structural support and reliability of integrated circuit packaging systems, enabling smaller pitch and lower package profiles, improved electrical connections, and reduced risk of detachment, while maintaining mechanical and environmental protection.
Implementation Method 1
provides structural support and adhesion between the interposer and the base substrate
Data Source
AI summary
A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.