Interposer Support Structure for Warpage-Resistant Semiconductor Packages
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Solution Overview
Problem
The existing semiconductor packages face challenges in preventing damage to the interposer, which affects the reliability of the connection between stacked semiconductor chips and substrates, particularly due to warpage and mechanical stress during bonding processes.
Innovation Solution
A semiconductor package design that includes a first substrate with insulating and conductive patterns, an interposer with separate insulating and conductive patterns, connecting members for electrical connection, and supporting members with solder parts and core parts of different melting points to maintain the interposer's distance from the substrate, preventing electrical connection and ensuring mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If supporting members are used to maintain the interposer's distance from the substrate, then mechanical support and warpage prevention are improved, but the risk of damage to the interposer during bonding increases
Solution Approach 1:
The supporting members utilize differential melting points of materials (solder vs. core material) to change their mechanical properties during the bonding process. The solder melts at a lower temperature, allowing the supporting members to become compliant during bonding, preventing interposer damage. After bonding, the solidified solder provides rigid support to maintain interposer position and prevent warpage.
2Reliability
If connecting members are used to electrically connect the first and second substrates, then electrical connectivity is improved, but the mechanical stress on the interposer increases
Solution Approach 1:
The patent separates the functions of electrical connection and mechanical support into distinct components. Connecting members (first and second connecting members) are dedicated to electrical connectivity between substrates, while supporting members are dedicated to mechanical support. This segmentation allows each component to be optimized for its specific function, reducing the mechanical stress burden on the interposer.
3Stability of the object's composition
If the supporting members are placed close to the interposer for better support, then warpage prevention is improved, but the risk of damage to the interposer during bonding increases
Solution Approach 1:
The supporting members are designed with a compliant phase during bonding (when solder is molten) that acts as a cushion, absorbing mechanical stresses and preventing interposer damage. After bonding, the same supporting members transition to a rigid state that provides strong support to prevent warpage. This beforehand cushioning allows close placement for effective warpage prevention without increasing damage risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the semiconductor package by preventing damage to the interposer and maintaining a predetermined distance, thereby improving the connection stability and preventing warpage during bonding, leading to improved product quality and reliability.
Implementation Method 1
The supporting members include solder parts, which have a first melting point, and core parts, which are disposed in the solder parts and have a second melting point that is higher than the first melting point
Data Source
AI summary
There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.