Interposer Supporting Portion for Semiconductor Package Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high-density chip stacking with structural stability, particularly in vertically stacking semiconductor chips, which often results in instability and damage due to external pressures and gravity.
Innovation Solution
The proposed solution involves a package-on-package (PoP) structure with an interposer substrate supported by a supporting portion that extends from the outer region of the interposer substrate toward the first substrate, reducing direct contact with the semiconductor chip and enhancing structural stability by distributing the load and preventing bending or damage from external pressures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor chips are vertically stacked to achieve high-density integration, then the area occupied is reduced, but structural stability deteriorates due to external pressures and gravity
Solution Approach 1:
The package is divided into multiple independent packages stacked vertically (lower package, interposer substrate, upper package), with each segment providing structural support. The supporting portions extend from outer regions to distribute loads, preventing the entire structure from failing under external pressure or gravity.
Solution Approach 2:
The supporting portions extend from the outer regions of the interposer substrate toward the first substrate in a downward direction, utilizing vertical spacing and lateral extension to create a distributed support structure that enhances stability without increasing the horizontal footprint of the package.
2Stability of the object's composition
If the interposer substrate is directly supported by the first substrate, then structural stability improves, but the semiconductor chip may be damaged due to direct contact with external pressures
Solution Approach 1:
The supporting portions act as intermediary elements between the interposer substrate and the first substrate. These supporting portions extend from outer regions and provide indirect support, distributing external pressures away from the semiconductor chip area while maintaining structural stability of the entire assembly.
Solution Approach 2:
The supporting portions are specifically positioned to extend from outer regions of the interposer substrate, creating localized support zones that are isolated from the central semiconductor chip area. This local support structure provides stability while protecting the chip region from direct pressure contact.
3Quantity of substance
If multiple semiconductor chips are stacked vertically, then integration density increases, but the complexity of fabrication and alignment increases
Solution Approach 1:
The multi-chip structure is segmented into modular packages (lower package, interposer substrate, upper package) that can be fabricated and prepared independently before stacking. Each segment contains its own substrate, semiconductor chip, and molding portion, simplifying the fabrication process while achieving high integration density through vertical assembly.
Data Source
AI summary
A semiconductor package may include a lower package including a first substrate, a first semiconductor chip on the first substrate, and a first molding portion on the first substrate to cover the first semiconductor chip, an interposer substrate on the first semiconductor chip, a supporting portion between the interposer substrate and the first substrate to support the interposer substrate, a connection terminal connecting the interposer substrate to the first substrate, and an upper package on the interposer substrate. The upper package may include a second substrate, a second semiconductor chip on the second substrate, and a second molding portion on the second substrate to cover the second semiconductor chip.