Interposer Contact Structure for Tall, Dense Signal Connections

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Solution Overview

Problem

Designing interposers that provide multiple parallel conductive paths between substrates separated by a large distance while maintaining mechanical reliability and high contact density is challenging, especially for tall and thin contacts.

Innovation Solution

The interposer contacts are designed with an intermediate portion, compliant arms extending in opposite directions, and a rigid projection between the arms, allowing two parallel conductive paths to be formed when compressed, and fabricated using a stamped metal sheet with specific bending to achieve reliable connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the separation distance between substrates is increased, then the interposer can accommodate taller components, but the contact density and mechanical reliability deteriorate

Engineering Contradiction:
Improveseparation distance between substratesVSAvoidcontact reliability
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The contact structure incorporates compliant arms that can dynamically deflect and adapt to varying separation distances between substrates. The compliant arms bend to accommodate different heights while maintaining reliable electrical connection, transforming a static rigid structure into a dynamic adaptive one that solves the reliability issue at large separations

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention introduces a lateral dimension by adding compliant arms extending perpendicular to the main contact path. These arms provide an additional degree of freedom for mechanical adjustment, allowing the contact to maintain reliability across varying separation distances without compromising contact density

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of moving object

If the contact height is increased to accommodate larger substrate separation, then the inductance increases, but the signal integrity deteriorates

Engineering Contradiction:
Improvecontact heightVSAvoidsignal integrity
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The contact is segmented into multiple functional portions: an intermediate portion for electrical connection, compliant arms for mechanical adaptation, and a rigid projection for structural support. This segmentation allows each portion to be optimized independently, reducing overall inductance while maintaining signal integrity across tall contacts

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rigid projection acts as an intermediary element between the compliant arms and the intermediate portion, providing a stable reference point that reduces inductance. This intermediary structure mediates between the need for height and the need for low inductance, solving the signal integrity problem

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If the contact density is increased, then the lateral extension is reduced, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvecontact densityVSAvoidfabrication precision
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The contact structure serves multiple functions simultaneously: the compliant arms provide both mechanical compliance and electrical connection, while the rigid projection provides both structural support and inductance reduction. This multi-functionality reduces the number of separate components needed, maintaining high contact density without proportionally increasing manufacturing complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures reliable electrical connections with reduced inductance and resistance, accommodating varying component heights and maintaining high contact density without increasing lateral extension, thus improving signal integrity.

Implementation Method 1

a first compliant arm extending from the intermediate portion in a first direction, the first compliant arm comprising a first contact region

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS20260045713A1High performance interposer
Publication Date: 2026.02.12 AMPHENOL CORP
  • US20260045713A1 patent drawing
  • US20260045713A1 patent drawing
  • US20260045713A1 patent drawing

AI summary

An interposer configured for connecting arrays of signal pads on parallel surfaces is described. Contacts of the interposer are configured to provide multiple conductive paths. A first conductive path extends through the body of the contact. A second conductive path is formed in parallel to the first conductive path when the contact is compressed between opposed substrates. The contact includes an intermediate portion, a rigid portion laterally extending from the intermediate portion, and a pair of compliant arms extending from the intermediate portion in opposite directions along the mating axis. When the contact is compressed, both arms touch and form an electrical connection with the rigid portion. The presence of the rigid portion allows for a reduction in the length of the beams in tall contacts.